Inventor · disambiguated record
Suming Hu
Also filed as: HU SUMING
9 granted patents·2 pending applications·19 citations·filing 2011–2024
82Inventor score
Files withADVANCED MICRO DEVICES INC5ATI TECHNOLOGIES ULC1HU SUMING1LEUNG ANDREW KW1MCLELLAN NEIL R1
Top patents by PatentIndex Score
11 records- 0193US11955447B2Semiconductor chip having stepped conductive pillarsADVANCED MICRO DEVICES INC·Filed 2021·Granted Apr 9, 2024·2 cites·20 claims
- 0280US9209106B2Thermal management circuit board for stacked semiconductor chip deviceSHI XIAO LING·Filed 2012·Granted Dec 8, 2015·10 cites·28 claims
- 0376US12417994B2Semiconductor chip having stepped conductive pillarsADVANCED MICRO DEVICES INC·Filed 2024·Granted Sep 16, 2025·0 cites·17 claims
- 0475US11335659B2Semiconductor chip with patterned underbump metallization and polymer filmATI TECHNOLOGIES ULC·Filed 2016·Granted May 17, 2022·2 cites·20 claims
- 0569US9576923B2Semiconductor chip with patterned underbump metallization and polymer filmTOPACIO RODEN R·Filed 2014·Granted Feb 21, 2017·2 cites·15 claims
- 0667US9867282B2Circuit board with corner hollowsHU SUMING·Filed 2014·Granted Jan 9, 2018·3 cites·20 claims
- 0756US2024332098A1Lid assembly for a chip packageADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 0853US11315883B2Integrated circuit product customizations for identification code visibilityADVANCED MICRO DEVICES INC·Filed 2019·Granted Apr 26, 2022·0 cites·21 claims
- 0952US12482683B2Carrier boat for die package flux cleaningADVANCED MICRO DEVICES INC·Filed 2021·Granted Nov 25, 2025·0 cites·20 claims
- 1042US8564122B2Circuit board component shim structureMCLELLAN NEIL R·Filed 2011·Granted Oct 22, 2013·0 cites·24 claims
- 1142US2016073493A1Stiffener ring for circuit boardLEUNG ANDREW KW·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →