Inventor · disambiguated record
Hsien-Tsung Liu
Also filed as: LIU HSIEN-TSUNG
5 granted patents·2 pending applications·124 citations·filing 1991–2006
81Inventor score
Top patents by PatentIndex Score
7 records- 0183US6583039B2Method of forming a bump on a copper padTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jun 24, 2003·37 cites·18 claims
- 0277US5180689ATapered opening sidewall with multi-step etching processTAIWAN SEMICONDUCTOR MFG·Filed 1991·Granted Jan 19, 1993·62 cites·20 claims
- 0373US6802945B2Method of metal sputtering for integrated circuit metal routingMEGIC CORP·Filed 2003·Granted Oct 12, 2004·10 cites·73 claims
- 0453US8723322B2Method of metal sputtering for integrated circuit metal routingLIU HSIEN-TSUNG·Filed 2006·Granted May 13, 2014·0 cites·27 claims
- 0553US6083790AMethod for making y-shaped multi-fin stacked capacitors for dynamic random access memory cellsTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Jul 4, 2000·15 cites·24 claims
- 0650US2005040033A1Method of metal sputtering for integrated circuit metal routingMEGIC CORP·Filed 2004·Application pending·0 cites
- 0736US2005186690A1Method for improving semiconductor wafer test accuracyMEGIC CORP·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →