Inventor · disambiguated record
Kuan-Ying Lai
Also filed as: LAI KUAN-YING
9 granted patents·1 pending application·8 citations·filing 2014–2021
79Inventor score
Top patents by PatentIndex Score
10 records- 0187US10505007B1Semiconductor device having asymmetric work function metal layerUNITED MICROELECTRONICS CORP·Filed 2018·Granted Dec 10, 2019·4 cites·14 claims
- 0276US10026827B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jul 17, 2018·2 cites·14 claims
- 0369US11881518B2Metal gate structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jan 23, 2024·0 cites·5 claims
- 0468US11929418B2Metal gate structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Mar 12, 2024·0 cites·17 claims
- 0563US12147163B2Method for correcting critical dimension measurements of lithographic toolUNITED MICROELECTRONICS CORP·Filed 2021·Granted Nov 19, 2024·0 cites·9 claims
- 0658US11205705B2Metal gate structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Dec 21, 2021·0 cites·7 claims
- 0758US10028905B2Substance delivery device and substance delivery method using the sameUNIV NAT CHENG KUNG·Filed 2014·Granted Jul 24, 2018·2 cites·17 claims
- 0853US11488829B1Method of forming a semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Nov 1, 2022·0 cites·9 claims
- 0944US10777420B1Etching back methodUNITED MICROELECTRONICS CORP·Filed 2019·Granted Sep 15, 2020·0 cites·19 claims
- 1036US2017309520A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →