Inventor · disambiguated record
Mark T. North
Also filed as: NORTH MARK · NORTH MARK T
11 granted patents·5 pending applications·210 citations·filing 1999–2023
91Inventor score
Top patents by PatentIndex Score
16 records- 0190US11480394B2Heat pipes having wick structures with variable permeabilityAAVID THERMAL CORP·Filed 2019·Granted Oct 25, 2022·7 cites·27 claims
- 0290US7044199B2Porous media cold plateTHERMAL CORP·Filed 2004·Granted May 16, 2006·50 cites·30 claims
- 0389US12247789B2Heat pipes having wick structures with variable permeabilityAAVID THERMAL CORP·Filed 2022·Granted Mar 11, 2025·1 cites·13 claims
- 0488US7690419B2Porous media cold plateTHERMAL CORP·Filed 2006·Granted Apr 6, 2010·15 cites·50 claims
- 0583US8397796B2Porous media cold plateTHAYER JOHN G·Filed 2010·Granted Mar 19, 2013·9 cites·13 claims
- 0683US6131650AFluid cooled single phase heat sinkTHERMAL CORP·Filed 1999·Granted Oct 17, 2000·87 cites·17 claims
- 0771US6637502B1Heat sink with converging deviceTHERMAL CORP·Filed 2002·Granted Oct 28, 2003·25 cites·12 claims
- 0864US7914529B2Cooling element for electrosurgeryTHERMAL CORP·Filed 2005·Granted Mar 29, 2011·4 cites·33 claims
- 0963US10648745B2Azeotropic working fluids and thermal management systems utilizing the sameTHERMAL CORP·Filed 2017·Granted May 12, 2020·0 cites·9 claims
- 1060US9417017B2Heat transfer apparatus and methodCIULLA ANTHONY·Filed 2013·Granted Aug 16, 2016·3 cites·11 claims
- 1159US6405792B1Compact fluid to fluid heat exchangerTHERMAL CORP·Filed 2001·Granted Jun 18, 2002·9 cites·14 claims
- 1253US2025003694A1Wick structure for optimized thermal performance and method of making the sameNVIDIA CORP·Filed 2023·Application pending·0 cites
- 1344US2011288548A1Cooling element for electrosurgeryBILSKI W JOHN·Filed 2011·Application pending·0 cites
- 1443US2020370838A1Heat pipe assembly and methodTHERMAL CORP·Filed 2020·Application pending·0 cites
- 1539US2004159934A1Heat pipe thermal management of high potential electronic chip packagesFiled 2004·Application pending·0 cites
- 1637US2002185726A1Heat pipe thermal management of high potential electronic chip packagesFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →