Inventor · disambiguated record
Jongvin Park
Also filed as: PARK JONGVIN
4 granted patents·74 citations·filing 2008–2012
76Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0193US8004093B2Integrated circuit package stacking systemSTATS CHIPPAC LTD·Filed 2008·Granted Aug 23, 2011·37 cites·18 claims
- 0292US7683469B2Package-on-package system with heat spreaderSTATS CHIPPAC LTD·Filed 2008·Granted Mar 23, 2010·32 cites·20 claims
- 0369US8569870B1Integrated circuit packaging system with shielding spacer and method of manufacture thereofLEE SINJAE·Filed 2012·Granted Oct 29, 2013·3 cites·10 claims
- 0464US8310038B2Integrated circuit packaging system with embedded conductive structure and method of manufacture thereofKIM JINGWAN·Filed 2011·Granted Nov 13, 2012·2 cites·20 claims
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