Inventor · disambiguated record
Hsun-Tien Li
Also filed as: LI HSUN-TIEN
10 granted patents·3 pending applications·90 citations·filing 2001–2015
87Inventor score
Top patents by PatentIndex Score
13 records- 0187US7057277B2Chip package structureMATSUSHITA ELECTRIC WORKS LTD·Filed 2004·Granted Jun 6, 2006·53 cites·22 claims
- 0282US8721919B2Organic-inorganic metal oxide hybrid resin, a method for forming the same, and transparent resin composition formed therefromIND TECH RES INST·Filed 2012·Granted May 13, 2014·3 cites·25 claims
- 0377US8013039B2Encapsulant composition for a light-emitting diodeIND TECH RES INST·Filed 2008·Granted Sep 6, 2011·3 cites·9 claims
- 0473US9617411B2Organic-inorganic hybrid resin, molding composition, and photoelectric device employing the sameIND TECH RES INST·Filed 2015·Granted Apr 11, 2017·1 cites·29 claims
- 0566US8440774B2Transparent silicone epoxy compositionLIN CHICH-HAW·Filed 2011·Granted May 14, 2013·3 cites·9 claims
- 0666US7061103B2Chip package structureMATSUSHITA ELECTRIC WORKS LTD·Filed 2004·Granted Jun 13, 2006·14 cites·16 claims
- 0759US7230331B2Chip package structure and process for fabricating the sameMATSUSHITA ELECTRIC WORKS LTD·Filed 2004·Granted Jun 12, 2007·8 cites·5 claims
- 0851US6821818B2Method of assembling a semiconductor device including sweeping (with a squeegee) encapsulant over the device repeatedlyIND TECH RES INST·Filed 2003·Granted Nov 23, 2004·5 cites·20 claims
- 0946US2006261499A1Chip package structureMATSUSHITA ELECTRIC WORKS LTD·Filed 2006·Application pending·0 cites
- 1045US2007072339A1Process for fabricating chip package structureCHEN KAI-CHI·Filed 2006·Application pending·0 cites
- 1144US6627684B2Dielectric compositions having two steps of laminating temperaturesIND TECH RES INST·Filed 2001·Granted Sep 30, 2003·0 cites·7 claims
- 1238US6841094B2Fine conductive particles for making anisotropic conductive adhesive compositionIND TECH RES INST·Filed 2002·Granted Jan 11, 2005·0 cites·24 claims
- 1338US2004212080A1[chip package structure and process for fabricating the same]Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →