Inventor · disambiguated record
Zhou Wei
Also filed as: WEI ZHOU
11 granted patents·1 pending application·249 citations·filing 2002–2022
92Inventor score
Top patents by PatentIndex Score
12 records- 0197US6949407B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 27, 2005·42 cites·18 claims
- 0296US6855572B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 15, 2005·96 cites·41 claims
- 0391US6836009B2Packaged microelectronic componentsMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 28, 2004·51 cites·53 claims
- 0488US7528477B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted May 5, 2009·10 cites·22 claims
- 0586US7679179B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 16, 2010·8 cites·19 claims
- 0685US8008126B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2009·Granted Aug 30, 2011·7 cites·14 claims
- 0783US7195957B2Packaged microelectronic componentsMICRON TECHNOLOGY INC·Filed 2004·Granted Mar 27, 2007·25 cites·6 claims
- 0874USD962641SFolding boxWEI ZHOU·Filed 2021·Granted Sep 6, 2022·8 cites·1 claims
- 0970US7276387B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted Oct 2, 2007·2 cites·19 claims
- 1056US12140547B2Digital surface-enhanced Raman spectroscopy sensing platformKOREA RES INST STANDARDS & SCI·Filed 2022·Granted Nov 12, 2024·0 cites·10 claims
- 1145US8637973B2Packaged microelectronic components with terminals exposed through encapsulantKOON ENG MEOW·Filed 2007·Granted Jan 28, 2014·0 cites·18 claims
- 1243US2007222053A1Semiconductor constructions having interconnect structures, methods of forming interconnect structures, and methods of forming semiconductor constructionsMICRON TECHNOLOGY INC·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →