Inventor · disambiguated record
Koji Araki
Also filed as: ARAKI KOJI
21 granted patents·9 pending applications·45 citations·filing 2002–2021
91Inventor score
Top patents by PatentIndex Score
30 records- 0189US11333546B2Combination weighing apparatus with improved hopper attachment workabilityISHIDA SEISAKUSHO·Filed 2020·Granted May 17, 2022·3 cites·6 claims
- 0285US7412821B2Control apparatus for internal combustion engineTOYOTA MOTOR CO LTD·Filed 2006·Granted Aug 19, 2008·16 cites·14 claims
- 0373US7216626B2Control apparatus for internal combustion engineTOYOTA MOTOR CO LTD·Filed 2005·Granted May 15, 2007·7 cites·34 claims
- 0465US11162191B2Thermal processing method for silicon waferGLOBALWAFERS JAPAN CO LTD·Filed 2017·Granted Nov 2, 2021·1 cites·4 claims
- 0563US8476149B2Method of manufacturing single crystal silicon wafer from ingot grown by Czocharlski process with rapid heating/cooling processISOGAI HIROMICHI·Filed 2009·Granted Jul 2, 2013·3 cites·10 claims
- 0662US10141180B2Silicon wafer and method for manufacturing the sameGLOBALWAFERS JAPAN CO LTD·Filed 2014·Granted Nov 27, 2018·1 cites·3 claims
- 0760US7201146B2Control apparatus for internal combustion engineTOYOTA MOTOR CO LTD·Filed 2005·Granted Apr 10, 2007·3 cites·18 claims
- 0856US11975923B2Article retaining device and supporting bodyISHIDA SEISAKUSHO·Filed 2020·Granted May 7, 2024·0 cites·11 claims
- 0955US11823985B2Leadframe, semiconductor device, and method for manufacturing semiconductor deviceTOSHIBA KK·Filed 2021·Granted Nov 21, 2023·0 cites·7 claims
- 1054USD496734SAssembled store for beauty and hairdressingQB NET CO LTD·Filed 2002·Granted Sep 28, 2004·11 cites·1 claims
- 1153US11267260B2Conveyance mechanism and label printerISHIDA SEISAKUSHO·Filed 2019·Granted Mar 8, 2022·0 cites·9 claims
- 1245US11060983B2Evaluation method of silicon waferGLOBALWAFERS JAPAN CO LTD·Filed 2018·Granted Jul 13, 2021·0 cites·6 claims
- 1345US2008237190A1Surface cleaning method of semiconductor wafer heat treatment boatCOVALENT MATERIALS CORP·Filed 2007·Application pending·0 cites
- 1441US9059099B2Thermal treatment method of silicon wafer and silicon waferSENDA TAKESHI·Filed 2012·Granted Jun 16, 2015·0 cites·8 claims
- 1541US8252700B2Method of heat treating silicon waferSENDA TAKESHI·Filed 2010·Granted Aug 28, 2012·0 cites·8 claims
- 1641US2005122009A1Compact shop and cabinet for hair dressing and beautyQB NET CO LTD·Filed 2003·Application pending·0 cites
- 1741US2008166891A1Heat treatment method for silicon waferCOVALENT MATERIALS CORP·Filed 2007·Application pending·0 cites
- 1840US10648101B2Silicon waferGLOBALWAFERS JAPAN CO LTD·Filed 2017·Granted May 12, 2020·0 cites·12 claims
- 1940US2015069593A1Semiconductor device and method of manufacturing sameTOSHIBA KK·Filed 2014·Application pending·0 cites
- 2039US8999864B2Silicon wafer and method for heat-treating silicon waferSENDA TAKESHI·Filed 2010·Granted Apr 7, 2015·0 cites·4 claims
- 2137US7143744B2Detection device and method for throttle opening degree, and compensation device and method for target throttle opening degreeTOYOTA MOTOR CO LTD·Filed 2005·Granted Dec 5, 2006·0 cites·15 claims
- 2237US2011023413A1Packaging apparatusISHIDA SEISAKUSHO·Filed 2010·Application pending·0 cites
- 2337US2013078588A1Method for heat-treating silicon waferSENDA TAKESHI·Filed 2012·Application pending·0 cites
- 2436US10099661B2Parking brake apparatusMITSUBISHI MOTORS CORP·Filed 2017·Granted Oct 16, 2018·0 cites·7 claims
- 2536US2017250137A1Semiconductor deviceTOSHIBA KK·Filed 2016·Application pending·0 cites
- 2635US2006207241A1Control apparatus for internal combustion engineTOYOTA MOTOR CO LTD·Filed 2006·Application pending·0 cites
- 2734US8399341B2Method for heat treating a silicon waferSENDA TAKESHI·Filed 2010·Granted Mar 19, 2013·0 cites·8 claims
- 2834US2016293446A1Method for manufacturing a silicon waferGLOBALWAFERS JAPAN CO LTD·Filed 2016·Application pending·0 cites
- 2933US10840089B2Protective-film forming method for semiconductor substrateGLOBALWAFERS JAPAN CO LTD·Filed 2017·Granted Nov 17, 2020·0 cites·7 claims
- 3029US10134661B2Semiconductor deviceTOSHIBA KK·Filed 2017·Granted Nov 20, 2018·0 cites·19 claims
Join the waitlist — get patent alerts
Get an alert when Koji Araki files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →