Inventor · disambiguated record
Justin E. Poarch
Also filed as: POARCH JUSTIN E · POARCH JUSTIN EUGENE
10 granted patents·1 pending application·85 citations·filing 2003–2019
88Inventor score
Top patents by PatentIndex Score
11 records- 0197US10269678B1Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereofNXP USA INC·Filed 2017·Granted Apr 23, 2019·31 cites·16 claims
- 0285US8841758B2Semiconductor device package and method of manufactureDANIELS DWIGHT L·Filed 2012·Granted Sep 23, 2014·9 cites·19 claims
- 0383US7868729B2Stacked device assembly with integrated coil and method of forming sameFREESCALE SEMICONDUCTOR INC·Filed 2009·Granted Jan 11, 2011·13 cites·20 claims
- 0478US10861764B2Microelectronic components having integrated heat dissipation posts and systems including the sameNXP USA INC·Filed 2019·Granted Dec 8, 2020·2 cites·20 claims
- 0577US9455216B2Semiconductor device package and method of manufactureFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Sep 27, 2016·2 cites·20 claims
- 0677US8685790B2Semiconductor device package having backside contact and method for manufacturingMAGNUS ALAN J·Filed 2012·Granted Apr 1, 2014·5 cites·12 claims
- 0766US7339275B2Multi-chips semiconductor device assemblies and methods for fabricating the sameFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted Mar 4, 2008·14 cites·12 claims
- 0862US7892950B2Methodology for processing a panel during semiconductor device fabricationFREESCALE SEMICONDUCTOR INC·Filed 2009·Granted Feb 22, 2011·2 cites·19 claims
- 0957US9093436B2Semiconductor device package and method of manufactureFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Jul 28, 2015·0 cites·10 claims
- 1056US7132303B2Stacked semiconductor device assembly and method for formingFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Nov 7, 2006·7 cites·30 claims
- 1150US2014167247A1Semiconductor device package having backside contact and method for manufacturingMAGNUS ALAN J·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →