Inventor · disambiguated record
Seri Lee
Also filed as: LEE SERI
16 granted patents·12 pending applications·405 citations·filing 2000–2022
94Inventor score
Files withINTEL CORP12NEXTREME THERMAL SOLUTIONS INC3PLOEG JOHAN F2ROGERS LESCO L2UNIV NANYANG TECH2
Top patents by PatentIndex Score
28 records- 0197US7321184B2Rake shaped fanINTEL CORP·Filed 2005·Granted Jan 22, 2008·58 cites·3 claims
- 0292US8267983B2Medical devices incorporating thermoelectric transducer and controllerROGERS LESCO L·Filed 2010·Granted Sep 18, 2012·48 cites·38 claims
- 0391US6633484B1Heat-dissipating devices, systems, and methods with small footprintINTEL CORP·Filed 2000·Granted Oct 14, 2003·65 cites·28 claims
- 0489US7495922B2Spring loaded heat sink retention mechanismINTEL CORP·Filed 2007·Granted Feb 24, 2009·22 cites·13 claims
- 0589US6535385B2High performance heat sink configurations for use in high density packaging applicationsINTEL CORP·Filed 2001·Granted Mar 18, 2003·56 cites·22 claims
- 0686US6757170B2Heat sink and package surface designINTEL CORP·Filed 2002·Granted Jun 29, 2004·40 cites·18 claims
- 0785US6870736B2Heat sink and package surface designINTEL CORP·Filed 2004·Granted Mar 22, 2005·38 cites·20 claims
- 0875US6479895B1High performance air cooled heat sinks used in high density packaging applicationsINTEL CORP·Filed 2001·Granted Nov 12, 2002·27 cites·33 claims
- 0970US6845010B2High performance heat sink configurations for use in high density packaging applicationsINTEL CORP·Filed 2003·Granted Jan 18, 2005·17 cites·12 claims
- 1069US7019977B2Method of attaching non-adhesive thermal interface materialsINTEL CORP·Filed 2003·Granted Mar 28, 2006·17 cites·19 claims
- 1164US8833435B2Microscale cooling apparatus and methodDETERMAN MATTHEW·Filed 2009·Granted Sep 16, 2014·8 cites·18 claims
- 1264US7499274B2Method, apparatus and system for enclosure enhancementINTEL CORP·Filed 2006·Granted Mar 3, 2009·2 cites·10 claims
- 1358US7535708B2Fan integrated thermal management deviceINTEL CORP·Filed 2006·Granted May 19, 2009·1 cites·20 claims
- 1457US10390991B2Medical devices incorporating thermoelectric transducer and controllerROGERS LESCO L·Filed 2012·Granted Aug 27, 2019·0 cites·55 claims
- 1554US2008264464A1Temperature Control Including Integrated Thermoelectric Sensing and Heat Pumping Devices and Related Methods and SystemsNEXTREME THERMAL SOLUTIONS INC·Filed 2008·Application pending·0 cites
- 1653US6501655B1High performance fin configuration for air cooled heat sinksINTEL CORP·Filed 2000·Granted Dec 31, 2002·6 cites·12 claims
- 1752US2009004034A1Piezoelectric fanLEE SERI·Filed 2007·Application pending·0 cites
- 1851US2010149719A1Thermal device with ionized air flowPLOEG JOHAN F·Filed 2009·Application pending·0 cites
- 1948US2009168344A1Thermal device with electrokinetic air flowPLOEG JOHAN F·Filed 2007·Application pending·0 cites
- 2047US9930842B2BioreactorUNIV NANYANG TECH·Filed 2012·Granted Apr 3, 2018·0 cites·18 claims
- 2146US2009205696A1Thermoelectric Heat Pumps Providing Active Thermal Barriers and Related Devices and MethodsNEXTREME THERMAL SOLUTIONS INC·Filed 2009·Application pending·0 cites
- 2245US2008168775A1Temperature Control Including Integrated Thermoelectric Temperature Sensing and Related Methods and SystemsNEXTREME THERMAL SOLUTIONS INC·Filed 2008·Application pending·0 cites
- 2341US2015000886A1Apparatus for Heat Dissipation and a Method for Fabricating the ApparatusUNIV NANYANG TECH·Filed 2012·Application pending·0 cites
- 2440US2008218972A1Cooling device, system containing same, and cooling methodSAUCIUC IOAN·Filed 2007·Application pending·0 cites
- 2538US2012087088A1Microscale heat transfer systemsKILLION JESSE DAVID·Filed 2010·Application pending·0 cites
- 2636US2024224474A1System for heat removal from server racksERS GX HOLDING PTE LTD·Filed 2022·Application pending·0 cites
- 2734US2002079097A1Heat sinkFiled 2000·Application pending·0 cites
- 2832US2004190245A1Radial heat sink with skived-shaped fin and methods of making sameFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →