Inventor · disambiguated record
Subhash L. Shinde
Also filed as: SHINDE SUBHASH L · SHINDE SUBHASH LAXMAN
49 granted patents·2 pending applications·771 citations·filing 1992–2014
98Inventor score
Top patents by PatentIndex Score
51 records- 0191US8907439B1Focal plane array with modular pixel array components for scalabilityKAY RANDOLPH R·Filed 2011·Granted Dec 9, 2014·48 cites·11 claims
- 0291US5628849AMethod for in-situ environment sensitive sealing and/or product controllingIBM·Filed 1995·Granted May 13, 1997·31 cites·41 claims
- 0390US9190392B1Three-dimensional stacked structured ASIC devices and methods of fabrication thereofSANDIA CORP·Filed 2014·Granted Nov 17, 2015·15 cites·18 claims
- 0490US6262390B1Repair process for aluminum nitride substratesIBM·Filed 1998·Granted Jul 17, 2001·66 cites·24 claims
- 0588US5755570AApparatus for in situ environment sensitive sealing and/or product controllingIBM·Filed 1995·Granted May 26, 1998·31 cites·44 claims
- 0688US5296189AMethod for producing metal powder with a uniform distribution of dispersants, method of uses thereof and structures fabricated therewithIBM·Filed 1992·Granted Mar 22, 1994·39 cites·28 claims
- 0787US6292367B1Thermally efficient semiconductor chipIBM·Filed 2000·Granted Sep 18, 2001·47 cites·13 claims
- 0885US7544527B2Method and apparatus for providing optoelectronic communication with an electronic deviceIBM·Filed 2006·Granted Jun 9, 2009·12 cites·3 claims
- 0982US6817776B2Method of bonding optical fibers and optical fiber assemblyIBM·Filed 2002·Granted Nov 16, 2004·25 cites·21 claims
- 1082US5981310AMulti-chip heat-sink cap assemblyIBM·Filed 1998·Granted Nov 9, 1999·59 cites·11 claims
- 1176US6762119B2Method of preventing solder wetting in an optical device using diffusion of CrINTERNAT BUSSINESS MACHINES CO·Filed 2001·Granted Jul 13, 2004·23 cites·18 claims
- 1275US7245022B2Semiconductor module with improved interposer structure and method for forming the sameIBM·Filed 2003·Granted Jul 17, 2007·17 cites·20 claims
- 1372US7473997B2Method for forming robust solder interconnect structures by reducing effects of seed layer underetchingIBM·Filed 2005·Granted Jan 6, 2009·4 cites·10 claims
- 1470US7084496B2Method and apparatus for providing optoelectronic communication with an electronic deviceIBM·Filed 2004·Granted Aug 1, 2006·14 cites·18 claims
- 1570US6373133B1Multi-chip module and heat-sink cap combinationIBM·Filed 1999·Granted Apr 16, 2002·34 cites·15 claims
- 1669US5541145ALow temperature sintering route for aluminum nitride ceramicsCARBORUNDUM CO·Filed 1995·Granted Jul 30, 1996·38 cites·60 claims
- 1768US6793407B2Manufacturable optical connection assembliesIBM·Filed 2002·Granted Sep 21, 2004·9 cites·16 claims
- 1867US6291272B1Structure and process for making substrate packages for high frequency applicationIBM·Filed 1999·Granted Sep 18, 2001·33 cites·32 claims
- 1961US6995084B2Method for forming robust solder interconnect structures by reducing effects of seed layer underetchingIBM·Filed 2004·Granted Feb 7, 2006·7 cites·12 claims
- 2059US5424261ALow temperature sintering route for aluminum nitride ceramicsCARBORUNDUM CO·Filed 1993·Granted Jun 13, 1995·19 cites·67 claims
- 2158US5218296AMethod and apparatus for determining at least one characteristic of a superconductive filmIBM·Filed 1992·Granted Jun 8, 1993·19 cites·19 claims
- 2256US8913856B2Manufacturable optical connection assembliesJACOBOWITZ LAWRENCE·Filed 2004·Granted Dec 16, 2014·4 cites·16 claims
- 2354US5773377ALow temperature sintered, resistive aluminum nitride ceramicsCRYSTALLINE MATERIALS CORP·Filed 1995·Granted Jun 30, 1998·22 cites·50 claims
- 2454US5753162AMethod for in-situ environment sensitive sealing and/or product controllingIBM·Filed 1996·Granted May 19, 1998·5 cites·22 claims
- 2552US7128472B2Method and apparatus for providing optoelectronic communication with an electronic deviceIBM·Filed 2003·Granted Oct 31, 2006·3 cites·15 claims
- 2652US5292477ASupersaturation method for producing metal powder with a uniform distribution of dispersants method of uses thereof and structures fabricated therewithIBM·Filed 1992·Granted Mar 8, 1994·20 cites·26 claims
- 2750US6827505B2Optoelectronic package structure and process for planar passive optical and optoelectronic devicesIBM·Filed 2002·Granted Dec 7, 2004·4 cites·20 claims
- 2850US6352014B1Method for making punches using multi-layer ceramic technologyIBM·Filed 1999·Granted Mar 5, 2002·12 cites·42 claims
- 2949US6652956B2X-ray printing personalization techniqueIBM·Filed 2001·Granted Nov 25, 2003·2 cites·9 claims
- 3049US6096565AMulti-layer glass ceramic module with superconductor wiringIBM·Filed 1999·Granted Aug 1, 2000·14 cites·5 claims
- 3149US2007252288A1Semiconductor module and method for forming the sameFAROOQ MUKTA G·Filed 2007·Application pending·0 cites
- 3247US6836015B2Optical assemblies for transmitting and manipulating optical beamsIBM·Filed 2003·Granted Dec 28, 2004·1 cites·20 claims
- 3347US5763093AAluminum nitride body having graded metallurgyIBM·Filed 1996·Granted Jun 9, 1998·10 cites·11 claims
- 3446US8089133B2Optical assemblies for transmitting and manipulating optical beamsGUPTA DINESH·Filed 2004·Granted Jan 3, 2012·1 cites·12 claims
- 3545US7767575B2Forming robust solder interconnect structures by reducing effects of seed layer underetchingTESSERA INTELLECTUAL PROPERTIE·Filed 2009·Granted Aug 3, 2010·0 cites·5 claims
- 3645US5682589AAluminum nitride body having graded metallurgyIBM·Filed 1996·Granted Oct 28, 1997·9 cites·12 claims
- 3745US5552107AAluminum nitride body having graded metallurgyIBM·Filed 1995·Granted Sep 3, 1996·9 cites·6 claims
- 3845US5304517AToughened glass ceramic substrates for semiconductor devices subjected to oxidizing atmospheres during sinteringIBM·Filed 1993·Granted Apr 19, 1994·11 cites·7 claims
- 3944US5932043AMethod for flat firing aluminum nitride/tungsten electronic modulesIBM·Filed 1997·Granted Aug 3, 1999·12 cites·53 claims
- 4044US5482903AAluminum nitride body utilizing a vitreous sintering additiveIBM·Filed 1993·Granted Jan 9, 1996·11 cites·7 claims
- 4143US6638681B2X-ray printing personalization techniqueIBM·Filed 2002·Granted Oct 28, 2003·0 cites·12 claims
- 4242US6413339B1Low temperature sintering of ferrite materialsIBM·Filed 1999·Granted Jul 2, 2002·7 cites·29 claims
- 4338US5911945AMethod for in-situ environment sensitive sealing and/or product controllingIBM·Filed 1997·Granted Jun 15, 1999·2 cites·18 claims
- 4438US5888446AMethod of forming an aluminum nitride article utilizing a platinum catalystIBM·Filed 1998·Granted Mar 30, 1999·5 cites·11 claims
- 4538US2003030869A1Active real-time alignment system for optoelectronic (OE) devicesIBM·Filed 2001·Application pending·0 cites
- 4637US6004624AMethod for the controlling of certain second phases in aluminum nitrideIBM·Filed 1997·Granted Dec 21, 1999·5 cites·6 claims
- 4736US6002951AMulti-layer ceramic substrate having high TC superconductor circuitryIBM·Filed 1997·Granted Dec 14, 1999·5 cites·8 claims
- 4834US6200373B1Method for controlling of certain second phases in aluminum nitrideIBM·Filed 1999·Granted Mar 13, 2001·3 cites·9 claims
- 4934US5552232AAluminum nitride body having graded metallurgyIBM·Filed 1994·Granted Sep 3, 1996·4 cites·10 claims
- 5030US5520878AAluminum nitride body and method for forming said body utilizing a vitreous sintering additiveIBM·Filed 1995·Granted May 28, 1996·0 cites·7 claims
Showing the top 50 of 51 patent records by PatentIndex Score.
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