Inventor · disambiguated record
Ryuji Norimoto
Also filed as: NORIMOTO RYUJI
3 granted patents·4 citations·filing 2006–2018
52Inventor score
Technology areasH10P
Files withDISCO CORP3
Top patents by PatentIndex Score
3 records- 0168US7439162B2Method of dividing wafer into individual devices after forming a recessed portion of the wafer and making thickness of wafer uniformDISCO CORP·Filed 2006·Granted Oct 21, 2008·4 cites·3 claims
- 0239US11114342B2Wafer processing methodDISCO CORP·Filed 2018·Granted Sep 7, 2021·0 cites·13 claims
- 0331US10629487B2Wafer dividing methodDISCO CORP·Filed 2017·Granted Apr 21, 2020·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →