Inventor · disambiguated record
Shih-Kuang Chiu
Also filed as: CHIU SHIH-KUANG
48 granted patents·17 pending applications·629 citations·filing 2000–2022
98Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD42BROGENT TECH INC6CHANG CHIANG-CHENG5CHAN CHANG-YUEH2HUANG CHUN-AN2
Top patents by PatentIndex Score
65 records- 0198US11213102B1Buckle deviceBROGENT TECH INC·Filed 2020·Granted Jan 4, 2022·11 cites·9 claims
- 0297US6787918B1Substrate structure of flip chip packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Sep 7, 2004·135 cites·13 claims
- 0394US8154115B1Package structure having MEMS element and fabrication method thereofCHAN CHANG-YUEH·Filed 2011·Granted Apr 10, 2012·16 cites·15 claims
- 0489US9659806B2Semiconductor package having conductive pillarsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted May 23, 2017·7 cites·20 claims
- 0589US6459144B1Flip chip semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Oct 1, 2002·69 cites·19 claims
- 0688US6391683B1Flip-chip semiconductor package structure and process for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted May 21, 2002·46 cites·7 claims
- 0786US6391682B1Method of performing flip-chip underfill in a wire-bonded chip-on-chip ball-grid array integrated circuit package moduleSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted May 21, 2002·42 cites·13 claims
- 0885US9899308B2Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Feb 20, 2018·4 cites·28 claims
- 0985US9812340B2Method of fabricating semiconductor package having semiconductor elementSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Nov 7, 2017·4 cites·14 claims
- 1085US9133021B2Wafer level package having a pressure sensor and fabrication method thereofCHANG HONG-DA·Filed 2011·Granted Sep 15, 2015·9 cites·8 claims
- 1185US8399940B2Package structure having MEMS elements and fabrication method thereofLIN CHEN-HAN·Filed 2011·Granted Mar 19, 2013·8 cites·24 claims
- 1285US6506626B1Semiconductor package structure with heat-dissipation stiffener and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Jan 14, 2003·36 cites·7 claims
- 1384US7485496B2Semiconductor device package with a heat sink and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted Feb 3, 2009·15 cites·18 claims
- 1483US11751642B2Buckle device capable of displaying locked stateBROGENT TECH INC·Filed 2022·Granted Sep 12, 2023·2 cites·15 claims
- 1583US6498054B1Method of underfilling a flip-chip semiconductor deviceSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Dec 24, 2002·36 cites·8 claims
- 1683US6404064B1Flip-chip bonding structure on substrate for flip-chip package applicationSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Jun 11, 2002·38 cites·12 claims
- 1780US8680692B2Carrier, semiconductor package and fabrication method thereofCHANG CHIANG-CHENG·Filed 2012·Granted Mar 25, 2014·5 cites·3 claims
- 1878US10049955B2Fabrication method of wafer level packaging semiconductor package with sandwich structure of support plate isolation layer and bonding layerSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Aug 14, 2018·2 cites·7 claims
- 1977US9520304B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Dec 13, 2016·4 cites·34 claims
- 2076US8334174B2Chip scale package and fabrication method thereofCHANG CHIANG-CHENG·Filed 2010·Granted Dec 18, 2012·6 cites·9 claims
- 2176US6856015B1Semiconductor package with heat sinkSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Feb 15, 2005·22 cites·20 claims
- 2275US9875981B2Semiconductor device having conductive viasSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Jan 23, 2018·2 cites·2 claims
- 2374US8610272B2Package structure with micro-electromechanical element and manufacturing method thereofHUANG CHUN-AN·Filed 2010·Granted Dec 17, 2013·4 cites·7 claims
- 2474US6489180B1Flip-chip packaging process utilizing no-flow underfill techniqueSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Dec 3, 2002·21 cites·18 claims
- 2572US10772390B2Buckle deviceBROGENT TECH INC·Filed 2019·Granted Sep 15, 2020·2 cites·10 claims
- 2672US6396156B1Flip-chip bonding structure with stress-buffering property and method for making the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted May 28, 2002·25 cites·20 claims
- 2771US9324585B2Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Apr 26, 2016·2 cites·5 claims
- 2871US6692629B1Flip-chip bumbing method for fabricating solder bumps on semiconductor waferSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Feb 17, 2004·16 cites·17 claims
- 2971US6348740B1Bump structure with dopantsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Feb 19, 2002·17 cites·8 claims
- 3070US9607939B2Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Mar 28, 2017·2 cites·21 claims
- 3169US9502333B2Semiconductor device having conductive viasSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Nov 22, 2016·2 cites·11 claims
- 3268US6600232B2Flip-chip semiconductor package structure and process for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Jul 29, 2003·12 cites·5 claims
- 3367US9991178B2Interposer and electrical testing method thereofChen lu yi·Filed 2012·Granted Jun 5, 2018·2 cites·8 claims
- 3467US9425119B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Aug 23, 2016·2 cites·30 claims
- 3565US9487393B2Fabrication method of wafer level package having a pressure sensorSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Nov 8, 2016·1 cites·8 claims
- 3656US10615055B2Method for fabricating package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Apr 7, 2020·0 cites·18 claims
- 3756US8829672B2Semiconductor package, package structure and fabrication method thereofCHEN YAN-HENG·Filed 2012·Granted Sep 9, 2014·1 cites·14 claims
- 3855US8633048B2Method for fabricating package structure having MEMS elementsLIN CHEN-HAN·Filed 2011·Granted Jan 21, 2014·1 cites·16 claims
- 3954US10950507B2Electrical testing method of interposerSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Mar 16, 2021·0 cites·12 claims
- 4053US9899237B2Carrier, semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Feb 20, 2018·0 cites·9 claims
- 4152US9117698B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Aug 25, 2015·0 cites·11 claims
- 4252US8741693B2Method for manufacturing package structure with micro-electromechanical elementSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Jun 3, 2014·0 cites·13 claims
- 4349US2015035164A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 4447US10199239B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Feb 5, 2019·0 cites·7 claims
- 4547US2013228915A1Semiconductor package and fabrication method thereofCHANG CHIANG-CHENG·Filed 2012·Application pending·0 cites
- 4646US2017148761A1Method of fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Application pending·0 cites
- 4745US2019246988A1Physiological signal correction device, correction method, and wearable device with correction functionIND TECH RES INST·Filed 2019·Application pending·0 cites
- 4844US9041189B2Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted May 26, 2015·0 cites·19 claims
- 4943US2008230878A1Leadframe based flip chip semiconductor package and lead frame thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 5041US2014134797A1Method for fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
Showing the top 50 of 65 patent records by PatentIndex Score.
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