Inventor · disambiguated record
Jetse De Witte
Also filed as: DE WITTE JETSE
5 granted patents·35 citations·filing 2015–2018
76Inventor score
Files withNXP BV5
Top patents by PatentIndex Score
5 records- 0193US9466585B1Reducing defects in wafer level chip scale package (WLCSP) devicesNXP BV·Filed 2015·Granted Oct 11, 2016·17 cites·12 claims
- 0292US10177111B2Reduction of defects in wafer level chip scale package (WLCSP) devicesNXP BV·Filed 2017·Granted Jan 8, 2019·10 cites·12 claims
- 0390US9704823B2Reduction of defects in wafer level chip scale package (WLCSP) devicesNXP BV·Filed 2015·Granted Jul 11, 2017·8 cites·4 claims
- 0441US10643957B2Conformal dummy dieNXP BV·Filed 2018·Granted May 5, 2020·0 cites·15 claims
- 0537US10431476B2Method of making a plurality of packaged semiconductor devicesNXP BV·Filed 2018·Granted Oct 1, 2019·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →