Inventor · disambiguated record
Hiroshi Inoguchi
Also filed as: INOGUCHI HIROSHI
10 granted patents·2 pending applications·94 citations·filing 1990–2023
86Inventor score
Top patents by PatentIndex Score
12 records- 0174US7317199B2Circuit deviceSANYO ELECTRIC CO·Filed 2005·Granted Jan 8, 2008·7 cites·14 claims
- 0272US6252252B1Optical semiconductor device and optical semiconductor module equipped with the sameSANYO ELECTRIC CO·Filed 1999·Granted Jun 26, 2001·47 cites·14 claims
- 0368US10361148B1Leadframe with efficient heat dissipation for semiconductor device package assemblySEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Jul 23, 2019·1 cites·21 claims
- 0466US5101880AFlaskless casting lineAISIN TAKAOKA LTD·Filed 1990·Granted Apr 7, 1992·13 cites·12 claims
- 0560US7531785B2Circuit device and method of manufacturing the sameSANYO ELECTRIC CO·Filed 2006·Granted May 12, 2009·2 cites·6 claims
- 0656US11519943B2Multi wire bonding with current sensing methodSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Dec 6, 2022·0 cites·17 claims
- 0755US6606174B1Optical semiconductor deviceSANYO ELECTRIC CO·Filed 1999·Granted Aug 12, 2003·24 cites·12 claims
- 0854US11101197B2Leadframe systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Aug 24, 2021·0 cites·20 claims
- 0951US2025201681A1Wire bonding using a floating padSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 1048US9699915B2Method of manufacture an electric circuitSEMICONDUCTOR COMPONENTS IND LLC·Filed 2014·Granted Jul 4, 2017·0 cites·9 claims
- 1141US2021320054A1Heatsink for thermal response control for integrated circuitsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Application pending·0 cites
- 1236US7307288B2Semiconductor device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2004·Granted Dec 11, 2007·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →