Inventor · disambiguated record
Yuji Okuda
Also filed as: OKUDA YUJI
30 granted patents·8 pending applications·431 citations·filing 1990–2020
96Inventor score
Top patents by PatentIndex Score
38 records- 0195US5230036ASpeech coding system utilizing a recursive computation technique for improvement in processing speedTOSHIBA KK·Filed 1990·Granted Jul 20, 1993·245 cites·6 claims
- 0289US9315194B2Low-level consciousness determination systemOKUDA YUJI·Filed 2012·Granted Apr 19, 2016·16 cites·5 claims
- 0383US10081389B2Driving support apparatus for vehicleTOYOTA MOTOR CO LTD·Filed 2016·Granted Sep 25, 2018·6 cites·4 claims
- 0481US9805275B2Drift-assessment deviceOKUDA YUJI·Filed 2012·Granted Oct 31, 2017·11 cites·3 claims
- 0579US10780916B2Lane departure suppression deviceDENSO CORP·Filed 2016·Granted Sep 22, 2020·4 cites·5 claims
- 0679US7040963B1Table of wafer polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor waferIBIDEN CO LTD·Filed 2000·Granted May 9, 2006·19 cites·37 claims
- 0776US10767994B2Sensor output correction apparatusDENSO CORP·Filed 2016·Granted Sep 8, 2020·2 cites·5 claims
- 0875US10065679B2Driving support device for vehicleTOYOTA MOTOR CO LTD·Filed 2016·Granted Sep 4, 2018·3 cites·11 claims
- 0975US9597960B2Driving assistance deviceOKUDA YUJI·Filed 2012·Granted Mar 21, 2017·5 cites·12 claims
- 1074US6475068B1Wafer holding plate for wafer grinding apparatus and method for manufacturing the sameIBIDEN CO LTD·Filed 2000·Granted Nov 5, 2002·14 cites·6 claims
- 1170US10562568B2Vehicle control deviceJTEKT CORP·Filed 2017·Granted Feb 18, 2020·2 cites·7 claims
- 1269US10081358B2Lane departure prevention apparatusDENSO CORP·Filed 2016·Granted Sep 25, 2018·2 cites·4 claims
- 1368US9994253B2Lane keeping assist apparatusTOYOTA MOTOR CO LTD·Filed 2016·Granted Jun 12, 2018·2 cites·2 claims
- 1467US9477095B1EyeglassesCHARMANT CO LTD·Filed 2015·Granted Oct 25, 2016·1 cites·12 claims
- 1567US5400399ASpeech communication apparatus equipped with echo cancellerTOSHIBA KK·Filed 1992·Granted Mar 21, 1995·45 cites·19 claims
- 1664US9862415B2Lane keeping assist apparatusTOYOTA MOTOR CO LTD·Filed 2014·Granted Jan 9, 2018·2 cites·6 claims
- 1764US9834213B2Lane keeping assist apparatusTOYOTA MOTOR CO LTD·Filed 2014·Granted Dec 5, 2017·3 cites·11 claims
- 1864US8086372B2Steering support deviceOKUDA YUJI·Filed 2007·Granted Dec 27, 2011·6 cites·2 claims
- 1963US9409478B2Sway determination device and sway determination methodOKUDA YUJI·Filed 2012·Granted Aug 9, 2016·3 cites·11 claims
- 2061US10839692B2Driving supporterTOYOTA MOTOR CO LTD·Filed 2017·Granted Nov 17, 2020·1 cites·5 claims
- 2159US2009242403A1Sensor element and gas sensorNGK INSULATORS LTD·Filed 2009·Application pending·0 cites
- 2257US2021008295A1Prefilled syringeTERUMO CORP·Filed 2020·Application pending·0 cites
- 2353US5991872AProcessorTOSHIBA KK·Filed 1997·Granted Nov 23, 1999·29 cites·13 claims
- 2449US8480870B2Sensor element and gas sensorSUZUKI YOSHIO·Filed 2012·Granted Jul 9, 2013·0 cites·7 claims
- 2548US2021008275A1Prefilled syringe, liquid medicine administration system, and syringe pumpTERUMO CORP·Filed 2020·Application pending·0 cites
- 2646US8795491B2Method of processing sensor element and sensor elementISHIKAWA TETSUYA·Filed 2011·Granted Aug 5, 2014·0 cites·6 claims
- 2745US7029379B2Wafer holding plate for wafer grinding apparatus and method for manufacturing the sameIBIDEN CO LTD·Filed 2005·Granted Apr 18, 2006·0 cites·12 claims
- 2844US2005260938A1Table of wafer polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor waferOKUDA YUJI·Filed 2005·Application pending·0 cites
- 2941US10644614B2Conversion device having a control unit for detecting arm short-circuitSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Granted May 5, 2020·0 cites·5 claims
- 3041US2016107645A1Departure prevention support apparatusTOYOTA MOTOR CO LTD·Filed 2014·Application pending·0 cites
- 3141US2014095027A1Driving assistance apparatus and driving assistance methodOKUDA YUJI·Filed 2013·Application pending·0 cites
- 3240US8226784B2Method of forming laminated body and method of manufacturing sensor elementOKUDA YUJI·Filed 2009·Granted Jul 24, 2012·0 cites·4 claims
- 3339US2005260930A1Table of wafer of polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor waferOKUDA YUJI·Filed 2005·Application pending·0 cites
- 3438US2017029026A1Driving support deviceTOYOTA MOTOR CO LTD·Filed 2016·Application pending·0 cites
- 3537US6916228B2Wafer holding plate for wafer grinding apparatus and method for manufacturing the sameIBIDEN CO LTD·Filed 2002·Granted Jul 12, 2005·0 cites·14 claims
- 3635US10137250B2Syringe and prefilled syringeTERUMO CORP·Filed 2015·Granted Nov 27, 2018·0 cites·11 claims
- 3732USRE36646ESpeech coding system utilizing a recursive computation technique for improvement in processing speedTOSHIBA KK·Filed 1995·Granted Apr 4, 2000·4 cites·7 claims
- 3832US5978925ASystem for improving processing efficiency in a pipeline by delaying a clock signal to a program counter and an instruction memory behind a system clockTOSHIBA KK·Filed 1997·Granted Nov 2, 1999·6 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →