Inventor · disambiguated record
Helmut Wurzer
Also filed as: WURZER HELMUT
10 granted patents·2 pending applications·184 citations·filing 1995–2003
89Inventor score
Top patents by PatentIndex Score
12 records- 0174US6781180B1Trench capacitor and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2000·Granted Aug 24, 2004·21 cites·21 claims
- 0266US6613624B2Method for fabricating an integrated semiconductor circuitINFINEON TECHNOLOGIES AG·Filed 2002·Granted Sep 2, 2003·14 cites·18 claims
- 0360US6451676B2Method for setting the threshold voltage of a MOS transistorINFINEON TECHNOLOGIES AG·Filed 2001·Granted Sep 17, 2002·13 cites·13 claims
- 0457US5849010AElectrosurgical apparatus and method for its operationWURZER HELMUT·Filed 1995·Granted Dec 15, 1998·107 cites·20 claims
- 0553US7465522B2Photolithographic mask having half tone main features and perpendicular half tone assist featuresINFINEON TECHNOLOGIES AG·Filed 2002·Granted Dec 16, 2008·4 cites·18 claims
- 0648US7078133B2Photolithographic maskINFINEON TECHNOLOGIES AG·Filed 2003·Granted Jul 18, 2006·3 cites·6 claims
- 0747US6958282B1SOI semiconductor configuration and method of fabricating the sameSIEMENS AG·Filed 1999·Granted Oct 25, 2005·15 cites·10 claims
- 0836US6960541B2Process for fabrication of a semiconductor component having a tungsten oxide layerINFINEON TECHNOLOGIES AG·Filed 2001·Granted Nov 1, 2005·0 cites·6 claims
- 0936US6232220B1Method for fabricating a semiconductor component having a low contact resistance with respect to heavily doped zonesINFINEON TECHNOLOGIES AG·Filed 1999·Granted May 15, 2001·7 cites·6 claims
- 1033US6730607B2Method for fabricating a barrier layerINFINEON TECHNOLOGIES AG·Filed 2001·Granted May 4, 2004·0 cites·7 claims
- 1130US2001046787A1Method for forming a dielectric on a semiconductor substrateFiled 2001·Application pending·0 cites
- 1228US2002068465A1Method of producing an oxidation-protected electrode for a capacitive electrode structureFiled 2000·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →