Inventor · disambiguated record
Jao-Chin Cheng
Also filed as: CHENG JAO-CHIN
8 granted patents·1 pending application·479 citations·filing 1998–2002
90Inventor score
Files withUNIMICRON TECHNOLOGY CORP4AMIC TECHNOLOGY INC2UNIMICRON TAIWAN CORP1WORLD WISER ELECTRICS INC1
Top patents by PatentIndex Score
9 records- 0196US6506632B1Method of forming IC package having downward-facing chip cavityUNIMICRON TECHNOLOGY CORP·Filed 2002·Granted Jan 14, 2003·164 cites·22 claims
- 0291US6506633B1Method of fabricating a multi-chip module packageUNIMICRON TECHNOLOGY CORP·Filed 2002·Granted Jan 14, 2003·81 cites·26 claims
- 0389US6709897B2Method of forming IC package having upward-facing chip cavityUNIMICRON TECHNOLOGY CORP·Filed 2002·Granted Mar 23, 2004·64 cites·30 claims
- 0489US6395633B1Method of forming micro-viaWORLD WISER ELECTRICS INC·Filed 2001·Granted May 28, 2002·96 cites·17 claims
- 0586US6749737B2Method of fabricating inter-layer solid conductive rodsUNIMICRON TAIWAN CORP·Filed 2001·Granted Jun 15, 2004·45 cites·11 claims
- 0662US6384613B1Wafer burn-in testing methodAMIC TECHNOLOGY INC·Filed 1998·Granted May 7, 2002·24 cites·8 claims
- 0738US6448170B1Method of producing external connector for substrateUNIMICRON TECHNOLOGY CORP·Filed 2001·Granted Sep 10, 2002·3 cites·15 claims
- 0832US2003113669A1Method of fabricating passive device on printed circuit boardFiled 2001·Application pending·0 cites
- 0930US6673652B1Underfilling method for a flip-chip packaging processAMIC TECHNOLOGY INC·Filed 1998·Granted Jan 6, 2004·2 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →