Inventor · disambiguated record
Joseph W. Buckfeller
Also filed as: BUCKFELLER JOSEPH · BUCKFELLER JOSEPH W · BUCKFELLER JOSEPH WILLIAM
13 granted patents·5 pending applications·189 citations·filing 1996–2025
91Inventor score
Files withLUCENT TECHNOLOGIES INC4AGERE SYSTEMS INC3TOSOH SMD INC3HERDT GREGORY CHARLES2AGERE SYST GUARDIAN CORP1
Top patents by PatentIndex Score
18 records- 0193US6720261B1Method and system for eliminating extrusions in semiconductor viasAGERE SYSTEMS INC·Filed 2000·Granted Apr 13, 2004·91 cites·16 claims
- 0279US8575752B2Modulated deposition process for stress control in thick TiN filmsTEXAS INSTRUMENTS INC·Filed 2012·Granted Nov 5, 2013·3 cites·5 claims
- 0368US6387817B1Plasma confinement shieldAGERE SYST GUARDIAN CORP·Filed 1999·Granted May 14, 2002·35 cites·4 claims
- 0466US8328585B2Modulated deposition process for stress control in thick TiN filmsHERDT GREGORY CHARLES·Filed 2009·Granted Dec 11, 2012·2 cites·12 claims
- 0564US2025327170A1Dynamic vacuum seal system for physical vapor deposition sputter applicationsTOSOH SMD INC·Filed 2023·Application pending·0 cites
- 0661US7137400B2Bypass loop gas flow calibrationAGERE SYSTEMS INC·Filed 2003·Granted Nov 21, 2006·14 cites·13 claims
- 0759US12387913B2Dynamic vacuum seal system for physical vapor deposition sputter applicationsTOSOH SMD INC·Filed 2025·Granted Aug 12, 2025·0 cites·28 claims
- 0853US5807760AMethod of despositing an aluminum-rich layerLUCENT TECHNOLOGIES INC·Filed 1996·Granted Sep 15, 1998·14 cites·7 claims
- 0951US10792788B2Optimized textured surfaces and methods of optimizingTOSOH SMD INC·Filed 2014·Granted Oct 6, 2020·0 cites·7 claims
- 1051US8592307B2Modulated deposition process for stress control in thick TiN filmsHERDT GREGORY CHARLES·Filed 2012·Granted Nov 26, 2013·0 cites·10 claims
- 1148US6169036B1Method for cleaning via openings in integrated circuit manufacturingLUCENT TECHNOLOGIES INC·Filed 1999·Granted Jan 2, 2001·16 cites·32 claims
- 1247US6136159AMethod for depositing metalLUCENT TECHNOLOGIES INC·Filed 1998·Granted Oct 24, 2000·10 cites·7 claims
- 1338US2004106279A1Method and system for eliminating extrusions in semiconductor viasFiled 2003·Application pending·0 cites
- 1436US5935396AMethod for depositing metalLUCENT TECHNOLOGIES INC·Filed 1997·Granted Aug 10, 1999·4 cites·3 claims
- 1532US7033931B2Temperature optimization of a physical vapor deposition process to prevent extrusion into openingsAGERE SYSTEMS INC·Filed 2003·Granted Apr 25, 2006·0 cites·30 claims
- 1629US2004250600A1Method of mass flow control flow verification and calibrationFiled 2004·Application pending·0 cites
- 1729US2004229477A1Apparatus and method for producing a <111> orientation aluminum film for an integrated circuit deviceFiled 2003·Application pending·0 cites
- 1828US2004226516A1Wafer pedestal coverFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →