Inventor · disambiguated record
Konstantinos I. Papathomas
Also filed as: PAPATHOMAS KONSTANTINOS · PAPATHOMAS KONSTANTINOS I
97 granted patents·3 pending applications·2,585 citations·filing 1990–2011
99Inventor score
Top patents by PatentIndex Score
100 records- 0198US5487218AMethod for making printed circuit boards with selectivity filled plated through holesIBM·Filed 1994·Granted Jan 30, 1996·284 cites·2 claims
- 0297US6931726B2Method of making and interconnect structureIBM·Filed 2003·Granted Aug 23, 2005·91 cites·3 claims
- 0397US6465084B1Method and structure for producing Z-axis interconnection assembly of printed wiring board elementsIBM·Filed 2001·Granted Oct 15, 2002·116 cites·12 claims
- 0496US8446707B1Circuitized substrate with low loss capacitive material and method of making sameDAS RABINDRA N·Filed 2011·Granted May 21, 2013·18 cites·11 claims
- 0596US6929900B2Tamper-responding encapsulated enclosure having flexible protective mesh structureIBM·Filed 2003·Granted Aug 16, 2005·127 cites·6 claims
- 0695US6686539B2Tamper-responding encapsulated enclosure having flexible protective mesh structureIBM·Filed 2001·Granted Feb 3, 2004·109 cites·17 claims
- 0794US6452117B2Method for filling high aspect ratio via holes in electronic substrates and the resulting holesIBM·Filed 2001·Granted Sep 17, 2002·76 cites·13 claims
- 0894US5557844AMethod of preparing a printed circuit boardIBM·Filed 1995·Granted Sep 24, 1996·138 cites·1 claims
- 0993US5796587APrinted circut board with embedded decoupling capacitance and method for producing sameIBM·Filed 1996·Granted Aug 18, 1998·99 cites·10 claims
- 1092US6479093B2Composite laminate circuit structure and methods of interconnecting the sameIBM·Filed 2002·Granted Nov 12, 2002·50 cites·17 claims
- 1189US6388204B1Composite laminate circuit structure and methods of interconnecting the sameIBM·Filed 2000·Granted May 14, 2002·75 cites·12 claims
- 1288US5900675AOrganic controlled collapse chip connector (C4) ball grid array (BGA) chip carrier with dual thermal expansion ratesIBM·Filed 1997·Granted May 4, 1999·93 cites·20 claims
- 1387US6581280B2Method for filling high aspect ratio via holes in electronic substratesIBM·Filed 2002·Granted Jun 24, 2003·40 cites·18 claims
- 1487US6504111B2Solid via layer to layer interconnectIBM·Filed 2001·Granted Jan 7, 2003·29 cites·16 claims
- 1587US6459047B1Laminate circuit structure and method of fabricatingIBM·Filed 2001·Granted Oct 1, 2002·31 cites·8 claims
- 1687US5981312AMethod for injection molded flip chip encapsulationIBM·Filed 1997·Granted Nov 9, 1999·72 cites·12 claims
- 1786US6734569B2Die attachment with reduced adhesive bleed-outIBM·Filed 2002·Granted May 11, 2004·42 cites·12 claims
- 1886US6645607B2Method and structure for producing Z-axis interconnection assembly of printed wiring board elementsIBM·Filed 2002·Granted Nov 11, 2003·24 cites·14 claims
- 1986US6534179B2Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and useIBM·Filed 2001·Granted Mar 18, 2003·25 cites·41 claims
- 2086US6090474AFlowable compositions and use in filling vias and plated through-holesIBM·Filed 1998·Granted Jul 18, 2000·45 cites·6 claims
- 2185US5599611APrepreg and cured laminate fabricated from a toughened polycyanurateIBM·Filed 1994·Granted Feb 4, 1997·30 cites·24 claims
- 2285US5527838AToughened polycyanurate resins containing particulatesIBM·Filed 1994·Granted Jun 18, 1996·30 cites·56 claims
- 2384US5527592AMultilayer article having a planarized outer layer comprising a toughened polycyanurateIBM·Filed 1994·Granted Jun 18, 1996·28 cites·5 claims
- 2483US6426470B1Formation of multisegmented plated through holesIBM·Filed 2001·Granted Jul 30, 2002·23 cites·15 claims
- 2582US6790473B2Lead protective coating composition, process and structure thereofIBM·Filed 2001·Granted Sep 14, 2004·38 cites·21 claims
- 2682US6343001B1Multilayer capacitance structure and circuit board containing the sameIBM·Filed 2000·Granted Jan 29, 2002·24 cites·15 claims
- 2780US6254972B1Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the sameIBM·Filed 1999·Granted Jul 3, 2001·29 cites·11 claims
- 2879US6820332B2Laminate circuit structure and method of fabricatingIBM·Filed 2002·Granted Nov 23, 2004·19 cites·20 claims
- 2979US6739027B1Method for producing printed circuit board with embedded decoupling capacitanceIBM·Filed 2000·Granted May 25, 2004·23 cites·7 claims
- 3078US6700078B2Formation of multisegmented plated through holesIBM·Filed 2002·Granted Mar 2, 2004·17 cites·11 claims
- 3178US5827907AHomo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resinIBM·Filed 1993·Granted Oct 27, 1998·19 cites·34 claims
- 3277US6570102B2Structure for high speed printed wiring boards with multiple differential impedance-controlled layerIBM·Filed 2001·Granted May 27, 2003·26 cites·20 claims
- 3376US9451693B2Electrically conductive adhesive (ECA) for multilayer device interconnectsDAS RABINDRA N·Filed 2011·Granted Sep 20, 2016·2 cites·43 claims
- 3476US6794040B2Flowable compositions and use in filling vias and plated through-holesIBM·Filed 2002·Granted Sep 21, 2004·10 cites·22 claims
- 3576US6501171B2Flip chip package with improved cap design and process for making thereofIBM·Filed 2001·Granted Dec 31, 2002·24 cites·36 claims
- 3674US6129955AEncapsulating a solder joint with a photo cured epoxy resin or cyanateIBM·Filed 1997·Granted Oct 10, 2000·48 cites·9 claims
- 3774US5288542AComposite for providing a rigid-flexible circuit board construction and method for fabrication thereofIBM·Filed 1992·Granted Feb 22, 1994·33 cites·25 claims
- 3873US7192997B2Encapsulant composition and electronic package utilizing sameIBM·Filed 2001·Granted Mar 20, 2007·14 cites·27 claims
- 3973US6496356B2Multilayer capacitance structure and circuit board containing the same and method of forming the sameIBM·Filed 2001·Granted Dec 17, 2002·14 cites·18 claims
- 4073US6407461B1Injection molded integrated circuit chip assemblyIBM·Filed 1997·Granted Jun 18, 2002·37 cites·5 claims
- 4173US6256850B1Method for producing a circuit board with embedded decoupling capacitanceIBM·Filed 1998·Granted Jul 10, 2001·28 cites·12 claims
- 4271US6593534B2Printed wiring board structure with z-axis interconnectionsIBM·Filed 2001·Granted Jul 15, 2003·17 cites·45 claims
- 4371US6427325B1Flowable compositions and use in filling vias and plated through-holesIBM·Filed 2000·Granted Aug 6, 2002·21 cites·13 claims
- 4469US6589639B2Hole fill composition and method for filling holes in a substrateIBM·Filed 2001·Granted Jul 8, 2003·11 cites·25 claims
- 4568US6570261B2Method and apparatus for injection molded flip chip encapsulationIBM·Filed 2002·Granted May 27, 2003·11 cites·5 claims
- 4667US7076869B2Solid via layer to layer interconnectIBM·Filed 2002·Granted Jul 18, 2006·10 cites·20 claims
- 4766US6524654B1Method of controlling the spread of an adhesive on a circuitized organic substrateIBM·Filed 2000·Granted Feb 25, 2003·10 cites·12 claims
- 4866US6252307B1Structure for preventing adhesive bleed onto surfacesIBM·Filed 2000·Granted Jun 26, 2001·12 cites·12 claims
- 4966US5292861ATrifunctional cyanate esters, polymers thereof; use and preparation thereofIBM·Filed 1992·Granted Mar 8, 1994·11 cites·10 claims
- 5065US6660945B2Interconnect structure and method of making sameIBM·Filed 2001·Granted Dec 9, 2003·9 cites·7 claims
Showing the top 50 of 100 patent records by PatentIndex Score.
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