Inventor · disambiguated record
Wei-Hsun Lin
Also filed as: LIN WEI · LIN WEI-HSUN
17 granted patents·3 pending applications·32 citations·filing 2011–2024
89Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD14CVC TECH INC1LIN WEI1MEDIATEK INC1MOTOROLA SOLUTIONS INC1
Top patents by PatentIndex Score
20 records- 0190US9372227B2Integrated circuit test system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jun 21, 2016·10 cites·17 claims
- 0289US11386019B1Data protection method and storage deviceMEDIATEK INC·Filed 2021·Granted Jul 12, 2022·4 cites·8 claims
- 0387US12313675B2Method and device for wafer-level testingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted May 27, 2025·0 cites·20 claims
- 0487US12270852B2Method and system for wafer-level testingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Apr 8, 2025·0 cites·20 claims
- 0584US9494562B2Method and apparatus for defect detection in composite structuresLIN WEI·Filed 2011·Granted Nov 15, 2016·16 cites·18 claims
- 0683US12066484B2Method and device for wafer-level testingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 20, 2024·0 cites·20 claims
- 0783US11073551B2Method and system for wafer-level testingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 27, 2021·1 cites·20 claims
- 0882US12025655B2Method and system for wafer-level testingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 2, 2024·0 cites·20 claims
- 0978US11754621B2Method and device for wafer-level testingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 12, 2023·0 cites·19 claims
- 1074US11630149B2Method and system for wafer-level testingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 18, 2023·0 cites·20 claims
- 1174US11448692B2Method and device for wafer-level testingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 20, 2022·0 cites·18 claims
- 1274US9902881B1Photosensitive adhesivePLASTICS IND DEVELOPMENT CENTER·Filed 2016·Granted Feb 27, 2018·1 cites·2 claims
- 1366US10718790B2Devices for high-density probing techniques and method of implementing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 21, 2020·0 cites·19 claims
- 1461US11249112B2Devices for high-density probing techniques and method of implementing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 15, 2022·0 cites·20 claims
- 1559US10274518B2Devices for high-density probing techniques and method of implementing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 30, 2019·0 cites·20 claims
- 1658US2025327859A1Systems and methods for automated analysis of voltage contrast defects in integrated circuit inspectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1754US12393336B2Data storage method, host system and data storage systemPHISON ELECTRONICS CORP·Filed 2023·Granted Aug 19, 2025·0 cites·18 claims
- 1854US9354254B2Test-yield improvement devices for high-density probing techniques and method of implementing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 31, 2016·0 cites·20 claims
- 1946US2023257207A1Compact and precise conveyor for a machine for recycling solar panelsCVC TECH INC·Filed 2022·Application pending·0 cites
- 2031US2017069109A1Method and apparatus for measuring an objectMOTOROLA SOLUTIONS INC·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →