Inventor · disambiguated record
Masakazu Hamada
Also filed as: HAMADA MASAKAZU
5 granted patents·4 pending applications·58 citations·filing 1989–2018
76Inventor score
Files withMITSUBISHI ELECTRIC CORP2PANASONIC IP MAN CO LTD2YANO HISASHI2FURUKAWA ELECTRIC CO LTD1HAMADA MASAKAZU1
Top patents by PatentIndex Score
9 records- 0172US6100112AMethod of manufacturing a tape carrier with bumpFURUKAWA ELECTRIC CO LTD·Filed 1998·Granted Aug 8, 2000·35 cites·16 claims
- 0268US5083401AMethod of polishingMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Jan 28, 1992·20 cites·17 claims
- 0365US7564133B2Semiconductor device and method for fabricating the samePANASONIC CORP·Filed 2006·Granted Jul 21, 2009·3 cites·7 claims
- 0442US11837516B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Dec 5, 2023·0 cites·16 claims
- 0538US9673139B2Semiconductor devicePANASONIC IP MAN CO LTD·Filed 2016·Granted Jun 6, 2017·0 cites·17 claims
- 0637US2007085211A1Semiconductor device and method for manufacturing the sameHAMADA MASAKAZU·Filed 2006·Application pending·0 cites
- 0735US2007145600A1Semiconductor device and manufacturing method thereofYANO HISASHI·Filed 2006·Application pending·0 cites
- 0835US2007145591A1Semiconductor device and manufacturing method therofYANO HISASHI·Filed 2006·Application pending·0 cites
- 0930US2017133500A1Nitride semiconductor devicePANASONIC IP MAN CO LTD·Filed 2017·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Masakazu Hamada files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →