Inventor · disambiguated record
Charles David Paynter
Also filed as: PAYNTER CHARLES D · PAYNTER CHARLES DAVID
16 granted patents·7 pending applications·65 citations·filing 2013–2024
90Inventor score
Files withQUALCOMM INC23
Top patents by PatentIndex Score
23 records- 0196US9263186B2DC/ AC dual function Power Delivery Network (PDN) decoupling capacitorQUALCOMM INC·Filed 2013·Granted Feb 16, 2016·38 cites·34 claims
- 0293US11452246B2Patch substrate configured as a shield located over a cavity of a boardQUALCOMM INC·Filed 2020·Granted Sep 20, 2022·5 cites·23 claims
- 0388US10321575B2Integrated circuit (IC) module comprising an integrated circuit (IC) package and an interposer with embedded passive componentsQUALCOMM INC·Filed 2015·Granted Jun 11, 2019·8 cites·26 claims
- 0477US10008316B2Inductor embedded in a package substrateQUALCOMM INC·Filed 2014·Granted Jun 26, 2018·4 cites·27 claims
- 0571US10170232B2Toroid inductor with reduced electromagnetic field leakageQUALCOMM INC·Filed 2015·Granted Jan 1, 2019·1 cites·16 claims
- 0670US12512401B2Integrated device substrate including embedded electromagnetic isolation structureQUALCOMM INC·Filed 2024·Granted Dec 30, 2025·0 cites·10 claims
- 0770US9041176B2Hybrid semiconductor module structureQUALCOMM INC·Filed 2013·Granted May 26, 2015·3 cites·30 claims
- 0868US9153560B2Package on package (PoP) integrated device comprising a redistribution layerQUALCOMM INC·Filed 2014·Granted Oct 6, 2015·2 cites·19 claims
- 0963US9484281B2Systems and methods for thermal dissipationQUALCOMM INC·Filed 2014·Granted Nov 1, 2016·1 cites·20 claims
- 1061US9514966B2Apparatus and methods for shielding differential signal pin pairsQUALCOMM INC·Filed 2014·Granted Dec 6, 2016·1 cites·15 claims
- 1160US2025201786A1Package comprising integrated devices and a passive deviceQUALCOMM INC·Filed 2023·Application pending·0 cites
- 1259US10231324B2Staggered power structure in a power distribution network (PDN)QUALCOMM INC·Filed 2014·Granted Mar 12, 2019·1 cites·30 claims
- 1358US12160952B2Providing a lower inductance path in a routing substrate for a capacitor, and related electronic devices and fabrication methodsQUALCOMM INC·Filed 2022·Granted Dec 3, 2024·0 cites·28 claims
- 1458US9871012B2Method and apparatus for routing die signals using external interconnectsQUALCOMM INC·Filed 2013·Granted Jan 16, 2018·1 cites·31 claims
- 1557US2025062285A1Stacked integrated circuit devicesQUALCOMM INC·Filed 2023·Application pending·0 cites
- 1657US2025069965A1Package comprising a substrate with an embedded frameQUALCOMM INC·Filed 2023·Application pending·0 cites
- 1755US12243855B2Package comprising channel interconnects located between solder interconnectsQUALCOMM INC·Filed 2021·Granted Mar 4, 2025·0 cites·20 claims
- 1852US11605594B2Package comprising a substrate and a high-density interconnect integrated device coupled to the substrateQUALCOMM INC·Filed 2020·Granted Mar 14, 2023·0 cites·26 claims
- 1952US2024038672A1Package comprising integrated devicesQUALCOMM INC·Filed 2022·Application pending·0 cites
- 2052US2024038831A1Package with a substrate comprising embedded stacked trench capacitor devicesQUALCOMM INC·Filed 2022·Application pending·0 cites
- 2150US11784157B2Package comprising integrated devices coupled through a metallization layerQUALCOMM INC·Filed 2021·Granted Oct 10, 2023·0 cites·33 claims
- 2240US2015372425A1Custom orientation of socket pins to achieve high isolation between channels without adding extra reference pinsQUALCOMM INC·Filed 2014·Application pending·0 cites
- 2337US2020020624A1Substrate-embedded substrateQUALCOMM INC·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →