Inventor · disambiguated record
Jimmy Liang
Also filed as: LIANG JIMMY
10 granted patents·5 pending applications·122 citations·filing 1995–2013
87Inventor score
Files withTAIWAN SEMICONDUCTOR MFG4MAO BANG ELECTRONIC CO LTD3TEXAS INSTRUMENTS INC3CHU KUEI-WU1CHU TSE MIN1
Top patents by PatentIndex Score
15 records- 0196US7838424B2Enhanced reliability of wafer-level chip-scale packaging (WLCSP) die separation using dry etchingTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Nov 23, 2010·84 cites·20 claims
- 0265US7642129B2Ball-mounting method for coplanarity improvement in large packageTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jan 5, 2010·3 cites·14 claims
- 0365US7056767B2Method and apparatus for flip chip device assembly by radiant heatingTEXAS INSTRUMENTS INC·Filed 2003·Granted Jun 6, 2006·16 cites·3 claims
- 0462US8049323B2Chip holder with wafer level redistribution layerTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Nov 1, 2011·2 cites·15 claims
- 0555US9362236B2Package structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 7, 2016·0 cites·22 claims
- 0652US8416576B2Integrated circuit cardCHU TSE MIN·Filed 2010·Granted Apr 9, 2013·2 cites·6 claims
- 0737US5644168AMechanical interlocking of fillers and epoxy/resinTEXAS INSTRUMENTS INC·Filed 1995·Granted Jul 1, 1997·10 cites·16 claims
- 0833US8184464B2Flash memoryCHU KUEI-WU·Filed 2010·Granted May 22, 2012·0 cites·8 claims
- 0929US6265769B1Double-sided chip mount packageTEXAS INSTRUMENTS INC·Filed 1998·Granted Jul 24, 2001·5 cites·5 claims
- 1029US2003132528A1Method and apparatus for flip chip device assembly by radiant heatingFiled 2001·Application pending·0 cites
- 1127US8424357B2Easily stackable diesLU LEO·Filed 2010·Granted Apr 23, 2013·0 cites·8 claims
- 1227US2012091595A1Layered Integrated Circuit ApparatusMA SUNG CHUAN·Filed 2010·Application pending·0 cites
- 1326US2011062590A1Chip Stacking Device Having Re-Distribution LayerMAO BANG ELECTRONIC CO LTD·Filed 2010·Application pending·0 cites
- 1426US2011108983A1Integrated CircuitMAO BANG ELECTRONIC CO LTD·Filed 2010·Application pending·0 cites
- 1526US2011062586A1Chip for Reliable Stacking on another ChipMAO BANG ELECTRONIC CO LTD·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →