Inventor · disambiguated record
Robert M. Japp
Also filed as: JAPP ROBERT · JAPP ROBERT M · JAPP ROBERT MAYNARD
77 granted patents·4 pending applications·1,864 citations·filing 1986–2010
99Inventor score
Files withIBM59ENDICOTT INTERCONNECT TECH INC12JAPP ROBERT M8INT BUSINESS MACJINES COPORATI1JAPP ROBERT1
Top patents by PatentIndex Score
81 records- 0198US6329603B1Low CTE power and ground planesIBM·Filed 1999·Granted Dec 11, 2001·135 cites·18 claims
- 0297US7508076B2Information handling system including a circuitized substrate having a dielectric layer without continuous fibersENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Mar 24, 2009·56 cites·18 claims
- 0397US5126192AFlame retardant, low dielectric constant microsphere filled laminateIBM·Filed 1990·Granted Jun 30, 1992·151 cites·13 claims
- 0495US6373717B1Electronic package with high density interconnect layerIBM·Filed 2000·Granted Apr 16, 2002·97 cites·16 claims
- 0594US6722031B2Method for making printed circuit board having low coefficient of thermal expansion power/ground planeIBM·Filed 2001·Granted Apr 20, 2004·53 cites·13 claims
- 0692US6613413B1Porous power and ground planes for reduced PCB delamination and better reliabilityIBM·Filed 1999·Granted Sep 2, 2003·76 cites·28 claims
- 0790US7687722B2Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Mar 30, 2010·25 cites·33 claims
- 0890US7470990B2Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Dec 30, 2008·16 cites·15 claims
- 0988US6399896B1Circuit package having low modulus, conformal mounting padsIBM·Filed 2000·Granted Jun 4, 2002·51 cites·12 claims
- 1088US6214525B1Printed circuit board with circuitized cavity and methods of producing sameIBM·Filed 1999·Granted Apr 10, 2001·105 cites·38 claims
- 1188US5900675AOrganic controlled collapse chip connector (C4) ball grid array (BGA) chip carrier with dual thermal expansion ratesIBM·Filed 1997·Granted May 4, 1999·93 cites·20 claims
- 1287US8198551B2Power core for use in circuitized substrate and method of making sameJAPP ROBERT M·Filed 2010·Granted Jun 12, 2012·9 cites·29 claims
- 1387US7596863B2Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities thereinENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Oct 6, 2009·19 cites·10 claims
- 1487US6459047B1Laminate circuit structure and method of fabricatingIBM·Filed 2001·Granted Oct 1, 2002·31 cites·8 claims
- 1586US6534179B2Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and useIBM·Filed 2001·Granted Mar 18, 2003·25 cites·41 claims
- 1685US6829823B2Method of making a multi-layered interconnect structureIBM·Filed 2002·Granted Dec 14, 2004·31 cites·25 claims
- 1785US6351030B2Electronic package utilizing protective coatingIBM·Filed 1999·Granted Feb 26, 2002·70 cites·9 claims
- 1883US7646098B2Multilayered circuitized substrate with p-aramid dielectric layers and method of making sameENDICOTT INTERCONNECT TECH INC·Filed 2008·Granted Jan 12, 2010·9 cites·13 claims
- 1983US7078816B2Circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2004·Granted Jul 18, 2006·23 cites·15 claims
- 2083US6426470B1Formation of multisegmented plated through holesIBM·Filed 2001·Granted Jul 30, 2002·23 cites·15 claims
- 2183US5888850AMethod for providing a protective coating and electronic package utilizing sameIBM·Filed 1997·Granted Mar 30, 1999·61 cites·30 claims
- 2282US6343001B1Multilayer capacitance structure and circuit board containing the sameIBM·Filed 2000·Granted Jan 29, 2002·24 cites·15 claims
- 2381US7416996B2Method of making circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Aug 26, 2008·7 cites·14 claims
- 2481US7270845B2Dielectric composition for forming dielectric layer for use in circuitized substratesENDICOTT INTERCONNECT TECH INC·Filed 2004·Granted Sep 18, 2007·19 cites·13 claims
- 2580US6944946B2Porous power and ground planes for reduced PCB delamination and better reliabilityIBM·Filed 2003·Granted Sep 20, 2005·21 cites·42 claims
- 2679US7416972B2Method of making same low moisture absorptive circuitized substrave with reduced thermal expansionENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Aug 26, 2008·6 cites·4 claims
- 2779US6820332B2Laminate circuit structure and method of fabricatingIBM·Filed 2002·Granted Nov 23, 2004·19 cites·20 claims
- 2879US6207595B1Laminate and method of manufacture thereofIBM·Filed 1998·Granted Mar 27, 2001·59 cites·8 claims
- 2978US6700078B2Formation of multisegmented plated through holesIBM·Filed 2002·Granted Mar 2, 2004·17 cites·11 claims
- 3076US6834426B1Method of fabricating a laminate circuit structureIBM·Filed 2000·Granted Dec 28, 2004·18 cites·10 claims
- 3176US5784782AMethod for fabricating printed circuit boards with cavitiesIBM·Filed 1996·Granted Jul 28, 1998·44 cites·18 claims
- 3275US6387205B1Dustfree prepreg and method for making an article based thereonIBM·Filed 2000·Granted May 14, 2002·16 cites·12 claims
- 3375US6176985B1Laminated electroplating rack and connection system for optimized platingIBM·Filed 1998·Granted Jan 23, 2001·29 cites·16 claims
- 3474US8084863B2Circuitized substrate with continuous thermoplastic support film dielectric layersJAPP ROBERT M·Filed 2008·Granted Dec 27, 2011·5 cites·13 claims
- 3573US7931830B2Dielectric composition for use in circuitized substrates and circuitized substrate including sameENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Apr 26, 2011·1 cites·17 claims
- 3673US7429789B2Fluoropolymer dielectric composition for use in circuitized substrates and circuitized substrate including sameENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Sep 30, 2008·5 cites·19 claims
- 3773US6496356B2Multilayer capacitance structure and circuit board containing the same and method of forming the sameIBM·Filed 2001·Granted Dec 17, 2002·14 cites·18 claims
- 3872US6073344ALaser segmentation of plated through-hole sidewalls to form multiple conductorsIBM·Filed 1999·Granted Jun 13, 2000·29 cites·22 claims
- 3971US5863332AFluid jet impregnating and coating device with thickness control capabilityIBM·Filed 1996·Granted Jan 26, 1999·26 cites·3 claims
- 4068US8211790B2Multilayered circuitized substrate with P-aramid dielectric layers and method of making sameJAPP ROBERT M·Filed 2009·Granted Jul 3, 2012·3 cites·6 claims
- 4166US6066386APrinted circuit board with cavity for circuitizationIBM·Filed 1998·Granted May 23, 2000·27 cites·9 claims
- 4266US4714504AProcess of laminating a photosensitive layer of a substrateIBM·Filed 1986·Granted Dec 22, 1987·26 cites·14 claims
- 4365US5824157AFluid jet impregnationIBM·Filed 1995·Granted Oct 20, 1998·21 cites·18 claims
- 4464US7070909B2UV absorbing glass cloth and use thereofIBM·Filed 2004·Granted Jul 4, 2006·9 cites·14 claims
- 4563US8499440B2Method of making halogen-free circuitized substrate with reduced thermal expansionJAPP ROBERT M·Filed 2009·Granted Aug 6, 2013·3 cites·18 claims
- 4663US7381587B2Method of making circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Jun 3, 2008·2 cites·12 claims
- 4763US6996903B2Formation of multisegmented plated through holesIBM·Filed 2003·Granted Feb 14, 2006·7 cites·8 claims
- 4863US6734259B1Resin composition with a polymerizing agent and method of manufacturing prepreg and other laminate structures therefromIBM·Filed 2002·Granted May 11, 2004·5 cites·18 claims
- 4962US6586352B1Method for reducing coefficient of thermal expansion in chip attach packagesIBM·Filed 2000·Granted Jul 1, 2003·10 cites·12 claims
- 5062US6429384B1Chip C4 assembly improvement using magnetic force and adhesiveIBM·Filed 2000·Granted Aug 6, 2002·9 cites·19 claims
Showing the top 50 of 81 patent records by PatentIndex Score.
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