Inventor · disambiguated record
Kazuto Fukuma
Also filed as: FUKUMA KAZUTO
3 granted patents·239 citations·filing 1990–1992
78Inventor score
Files withAPPLIED MATERIALS INC3
Top patents by PatentIndex Score
3 records- 0194US5314845ATwo step process for forming void-free oxide layer over stepped surface of semiconductor waferAPPLIED MATERIALS INC·Filed 1990·Granted May 24, 1994·122 cites·24 claims
- 0289US5166101AMethod for forming a boron phosphorus silicate glass composite layer on a semiconductor waferAPPLIED MATERIALS INC·Filed 1991·Granted Nov 24, 1992·73 cites·17 claims
- 0381US5354387ABoron phosphorus silicate glass composite layer on semiconductor waferAPPLIED MATERIALS INC·Filed 1992·Granted Oct 11, 1994·44 cites·19 claims
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