Inventor · disambiguated record
Erik A. Edelberg
Also filed as: EDELBERG ERIK · EDELBERG ERIK A
12 granted patents·8 pending applications·877 citations·filing 2001–2015
92Inventor score
Top patents by PatentIndex Score
20 records- 0198US8425682B2High strip rate downstream chamberLAM RES CORP·Filed 2012·Granted Apr 23, 2013·378 cites·16 claims
- 0296US8298336B2High strip rate downstream chamberWANG ING-YANN·Filed 2005·Granted Oct 30, 2012·384 cites·28 claims
- 0394US7977390B2Method for plasma etching performance enhancementLAM RES CORP·Filed 2006·Granted Jul 12, 2011·29 cites·18 claims
- 0492US7547636B2Pulsed ultra-high aspect ratio dielectric etchLAM RES CORP·Filed 2007·Granted Jun 16, 2009·22 cites·18 claims
- 0590US8475673B2Method and apparatus for high aspect ratio dielectric etchEDELBERG ERIK A·Filed 2009·Granted Jul 2, 2013·22 cites·13 claims
- 0689US7682986B2Ultra-high aspect ratio dielectric etchLAM RES CORP·Filed 2007·Granted Mar 23, 2010·13 cites·18 claims
- 0776US7542134B2System, method and apparatus for in-situ substrate inspectionLAM RES CORP·Filed 2008·Granted Jun 2, 2009·4 cites·9 claims
- 0870US7083903B2Methods of etching photoresist on substratesLAM RES CORP·Filed 2003·Granted Aug 1, 2006·13 cites·35 claims
- 0964US7204934B1Method for planarization etch with in-situ monitoring by interferometry prior to recess etchLAM RES CORP·Filed 2001·Granted Apr 17, 2007·10 cites·23 claims
- 1063US8906194B2Ultra-high aspect ratio dielectric etchCHI KYEONG-KOO·Filed 2010·Granted Dec 9, 2014·1 cites·14 claims
- 1156US7397555B2System, method and apparatus for in-situ substrate inspectionLAM RES CORP·Filed 2004·Granted Jul 8, 2008·1 cites·10 claims
- 1251US2008182422A1Methods of etching photoresist on substratesLAM RES CORP·Filed 2007·Application pending·0 cites
- 1351US2013264201A1Method and apparatus for high aspect ratio dielectric etchLAM RES CORP·Filed 2013·Application pending·0 cites
- 1449US2008119055A1Reducing twisting in ultra-high aspect ratio dielectric etchLAM RES CORP·Filed 2006·Application pending·0 cites
- 1547US2006201911A1Methods of etching photoresist on substratesLAM RES CORP·Filed 2006·Application pending·0 cites
- 1646US8741165B2Reducing twisting in ultra-high aspect ratio dielectric etchJI BING·Filed 2010·Granted Jun 3, 2014·0 cites·19 claims
- 1742US2006051965A1Methods of etching photoresist on substratesLAM RES CORP·Filed 2004·Application pending·0 cites
- 1841US2014261803A1High strip rate downstream chamberLAM RES CORP·Filed 2013·Application pending·0 cites
- 1935US2016102416A1Low copper/high halide electroplating solutions for fill and defect controlNOVELLUS SYSTEMS INC·Filed 2015·Application pending·0 cites
- 2034US2006228889A1Methods of removing resist from substrates in resist stripping chambersEDELBERG ERIK A·Filed 2005·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Erik A. Edelberg files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →