Inventor · disambiguated record
Jamin Ling
Also filed as: LING JAMIN
6 granted patents·111 citations·filing 1995–2007
83Inventor score
Files withST MICROELECTRONICS INC2FLIP CHIP TECHNOLOGIES L L C1KULICKE & SOFFA IND INC1ST ASSEMBLY TEST SERVICES LTD1SV PROBE PTE LTD1
Top patents by PatentIndex Score
6 records- 0185US6445069B1Electroless Ni/Pd/Au metallization structure for copper interconnect substrate and method thereforFLIP CHIP TECHNOLOGIES L L C·Filed 2001·Granted Sep 3, 2002·63 cites·23 claims
- 0270US7442641B2Integrated ball and via package and formation processKULICKE & SOFFA IND INC·Filed 2005·Granted Oct 28, 2008·5 cites·11 claims
- 0361US6180509B1Method for forming planarized multilevel metallization in an integrated circuitST MICROELECTRONICS INC·Filed 1997·Granted Jan 30, 2001·24 cites·31 claims
- 0454US7091469B2Packaging for optoelectronic devicesST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Aug 15, 2006·6 cites·20 claims
- 0548US6191484B1Method of forming planarized multilevel metallization in an integrated circuitST MICROELECTRONICS INC·Filed 1995·Granted Feb 20, 2001·13 cites·20 claims
- 0629US7637009B2Approach for fabricating probe elements for probe card assemblies using a reusable substrateSV PROBE PTE LTD·Filed 2007·Granted Dec 29, 2009·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →