Inventor · disambiguated record
Akira Sasame
Also filed as: SASAME AKIRA
15 granted patents·248 citations·filing 1988–2010
93Inventor score
Top patents by PatentIndex Score
15 records- 0177US7180178B2Semiconductor heat-dissipating substrate, and manufacturing method and package thereforSUMITOMO ELECTRIC INDUSTRIES·Filed 2005·Granted Feb 20, 2007·7 cites·25 claims
- 0271US4886709AMember for semiconductor apparatusSUMITOMO ELECTRIC INDUSTRIES·Filed 1988·Granted Dec 12, 1989·38 cites·9 claims
- 0369US5034357AHeat-conductive aluminum nitride sintered body and method of manufacturing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 1989·Granted Jul 23, 1991·30 cites·23 claims
- 0468US5010388AConnection structure between components for semiconductor apparatusSUMITOMO ELECTRIC INDUSTRIES·Filed 1988·Granted Apr 23, 1991·36 cites·9 claims
- 0568US4965659AMember for a semiconductor structureSUMITOMO ELECTRIC INDUSTRIES·Filed 1988·Granted Oct 23, 1990·34 cites·9 claims
- 0662US7741238B2Spinel sintered body, light transmitting window and light transmitting lensSUMITOMO ELECTRIC INDUSTRIES·Filed 2006·Granted Jun 22, 2010·1 cites·7 claims
- 0762US5529852AAluminum nitride sintered body having a metallized coating layer on its surfaceSUMITOMO ELECTRIC INDUSTRIES·Filed 1994·Granted Jun 25, 1996·32 cites·14 claims
- 0859US8097550B2Spinel sintered body, light transmitting window and light transmitting lensSASAME AKIRA·Filed 2010·Granted Jan 17, 2012·1 cites·8 claims
- 0959US5085923AHeat-conductive aluminum nitride sintered body and method of manufacturing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 1991·Granted Feb 4, 1992·24 cites·6 claims
- 1056US5998043AMember for semiconductor device using an aluminum nitride substrate material, and method of manufacturing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 1997·Granted Dec 7, 1999·21 cites·18 claims
- 1151US6783867B2Member for semiconductor device using an aluminum nitride substrate material, and method of manufacturing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2003·Granted Aug 31, 2004·4 cites·10 claims
- 1244US6979901B2Semiconductor heat-dissipating substrate, and manufacturing method and package thereforSUMITOMO ELECTRIC INDUSTRIES·Filed 2002·Granted Dec 27, 2005·1 cites·20 claims
- 1340US5134461ACeramics substrate with an improved surface structure for electronic componentsSUMITOMO ELECTRIC INDUSTRIES·Filed 1990·Granted Jul 28, 1992·10 cites·8 claims
- 1433US5292552AMethod for forming metallized layer on an aluminum nitride sintered bodySUMITOMO ELECTRIC INDUSTRIES·Filed 1992·Granted Mar 8, 1994·4 cites·4 claims
- 1533US5190601ASurface structure of ceramics substrate and method of manufacturing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 1991·Granted Mar 2, 1993·5 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →