Inventor · disambiguated record
Ayako Kawanishi
Also filed as: KAWANISHI AYAKO
10 granted patents·6 pending applications·16 citations·filing 2013–2025
82Inventor score
Top patents by PatentIndex Score
16 records- 0188US9371427B2Pattern forming methodTOSHIBA KK·Filed 2015·Granted Jun 21, 2016·5 cites·20 claims
- 0281US9685331B1Semiconductor device manufacturing method and pattern forming methodTOSHIBA KK·Filed 2016·Granted Jun 20, 2017·4 cites·20 claims
- 0379US9023222B2Pattern forming methodTOSHIBA KK·Filed 2013·Granted May 5, 2015·4 cites·17 claims
- 0472US2025293181A1Memory deviceKIOXIA CORP·Filed 2025·Application pending·0 cites
- 0569US9040429B2Pattern formation methodTOSHIBA KK·Filed 2013·Granted May 26, 2015·2 cites·19 claims
- 0665US12388031B2Memory deviceKIOXIA CORP·Filed 2022·Granted Aug 12, 2025·0 cites·20 claims
- 0760US9279191B2Pattern forming methodTOSHIBA KK·Filed 2013·Granted Mar 8, 2016·1 cites·16 claims
- 0857US9040123B2Pattern formation methodTOSHIBA KK·Filed 2013·Granted May 26, 2015·0 cites·12 claims
- 0953US2024304576A1Semiconductor deviceKIOXIA CORP·Filed 2024·Application pending·0 cites
- 1052US2015151329A1Pattern Forming MethodTOSHIBA KK·Filed 2014·Application pending·0 cites
- 1145US8980755B2Method of pattern formationTOSHIBA KK·Filed 2013·Granted Mar 17, 2015·0 cites·15 claims
- 1244US2023090711A1Semiconductor memory deviceKIOXIA CORP·Filed 2022·Application pending·0 cites
- 1341US2014248439A1Pattern formation methodTOSHIBA KK·Filed 2013·Application pending·0 cites
- 1436US10692886B2Semiconductor memory device having vertical semiconductor films with narrowing widths and gate insulating films with different thicknessTOSHIBA MEMORY CORP·Filed 2019·Granted Jun 23, 2020·0 cites·9 claims
- 1535US9816004B2Lithography pattern forming method using self-organizing block copolymerTOSHIBA MEMORY CORP·Filed 2016·Granted Nov 14, 2017·0 cites·19 claims
- 1635US2018275519A1Pattern Formation MethodTOSHIBA MEMORY CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →