Inventor · disambiguated record
James Neeb
Also filed as: NEEB JAMES · NEEB JAMES E · NEEB JAMES EDWARD
13 granted patents·3 pending applications·112 citations·filing 1998–2023
91Inventor score
Top patents by PatentIndex Score
16 records- 0196US9869714B2Integrated circuit test temperature control mechanismINTEL CORP·Filed 2016·Granted Jan 16, 2018·9 cites·12 claims
- 0295US9400291B2Integrated circuit test temperature control mechanismJOHNSON JOHN C·Filed 2012·Granted Jul 26, 2016·15 cites·18 claims
- 0385US9886401B2Bus for communication between devicesINTEL CORP·Filed 2016·Granted Feb 6, 2018·6 cites·18 claims
- 0481US6766486B2Joint test action group (JTAG) tester, such as to test integrated circuits in parallelINTEL CORP·Filed 2000·Granted Jul 20, 2004·27 cites·16 claims
- 0578US6441637B1Apparatus and method for power continuity testing in a parallel testing systemINTEL CORP·Filed 2000·Granted Aug 27, 2002·19 cites·20 claims
- 0666US9454499B2Asynchronous communication between devicesINTEL CORP·Filed 2013·Granted Sep 27, 2016·2 cites·22 claims
- 0757US6163161ADirected self-heating for reduction of system test timeINTEL CORP·Filed 1998·Granted Dec 19, 2000·20 cites·16 claims
- 0855US6621287B2Connector assembly with decoupling capacitorsINTEL CORP·Filed 2001·Granted Sep 16, 2003·5 cites·18 claims
- 0953US6559673B2Apparatus and method for power continuity testing in a parallel testing systemINTEL CORP·Filed 2002·Granted May 6, 2003·5 cites·8 claims
- 1049US11193975B2Compressed test patterns for a field programmable gate arrayINTEL CORP·Filed 2018·Granted Dec 7, 2021·0 cites·20 claims
- 1148US6898852B2Connector assembly with decoupling capacitorsINTEL CORP·Filed 2003·Granted May 31, 2005·4 cites·8 claims
- 1248US2025208195A1Method and apparatus to select a portion of serial test data received from an integrated circuit to capture during test of the integrated circuitINTEL CORP·Filed 2023·Application pending·0 cites
- 1346US2024219452A1Method and system for a vacuum compatible electrical interface, enabling microprocessor debug, at high speed, inside an electron beam probeINTEL CORP·Filed 2022·Application pending·0 cites
- 1445US9548284B2Reduced expansion thermal compression bonding process bond headINTEL CORP·Filed 2013·Granted Jan 17, 2017·0 cites·8 claims
- 1539US2016313370A1Semiconductor device tester with dut data streamingINTEL CORP·Filed 2014·Application pending·0 cites
- 1637US11598804B2Debug tool for test instruments coupled to a device under testINTEL CORP·Filed 2019·Granted Mar 7, 2023·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →