Inventor · disambiguated record
Haruya Sakuma
Also filed as: SAKUMA HARUYA
3 granted patents·2 pending applications·2 citations·filing 2009–2022
49Inventor score
Top patents by PatentIndex Score
5 records- 0152US12304008B2Flux and method for producing assemblySENJU METAL INDUSTRY CO·Filed 2022·Granted May 20, 2025·0 cites·15 claims
- 0252US9198284B2Circuit board and method for manufacturing sameSAKUMA HARUYA·Filed 2010·Granted Nov 24, 2015·2 cites·15 claims
- 0351US2023112020A1Preform solder and bonding method using sameSENJU METAL INDUSTRY CO·Filed 2020·Application pending·0 cites
- 0446US8270179B2Printed circuit board and method for mounting electronic componentsYAMAUCHI HIDEAKI·Filed 2009·Granted Sep 18, 2012·0 cites·12 claims
- 0539US2022402057A1Magnetic-field melting solder, and joining method in which same is usedSENJU METAL INDUSTRY CO·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →