Inventor · disambiguated record
Paul Ying-Fung Wu
Also filed as: WU PAUL · WU PAUL Y · WU PAUL Y F · WU PAUL YING-FUNG
47 granted patents·6 pending applications·1,775 citations·filing 1994–2023
99Inventor score
Top patents by PatentIndex Score
53 records- 0198US9635011B1Encryption and decryption techniques using shuffle functionJONETIX CORP·Filed 2015·Granted Apr 25, 2017·117 cites·30 claims
- 0298US7378733B1Composite flip-chip package with encased components and method of fabricating sameXILINX INC·Filed 2006·Granted May 27, 2008·112 cites·11 claims
- 0397US10891366B1Secure hardware signature and related methods and applicationsJONETIX CORP·Filed 2018·Granted Jan 12, 2021·41 cites·19 claims
- 0496US10021085B1Encryption and decryption techniques using shuffle functionJONETIX CORP·Filed 2017·Granted Jul 10, 2018·21 cites·21 claims
- 0596US9006030B1Warpage management for fan-out mold packaged integrated circuitXILINX INC·Filed 2013·Granted Apr 14, 2015·47 cites·16 claims
- 0696US7696006B1Composite flip-chip package with encased components and method of fabricating sameXILINX INC·Filed 2008·Granted Apr 13, 2010·44 cites·7 claims
- 0796US6034427ABall grid array structure and method for packaging an integrated circuit chipPROLINX LABS CORP·Filed 1998·Granted Mar 7, 2000·294 cites·41 claims
- 0894US9337138B1Capacitors within an interposer coupled to supply and ground planes of a substrateABUGHARBIEH KHALDOON S·Filed 2012·Granted May 10, 2016·36 cites·16 claims
- 0994US7511299B1Packaged integrated circuit with raised test pointsXILINX INC·Filed 2007·Granted Mar 31, 2009·28 cites·19 claims
- 1094US7098542B1Multi-chip configuration to connect flip-chips to flip-chipsXILINX INC·Filed 2003·Granted Aug 29, 2006·95 cites·30 claims
- 1194US5906042AMethod and structure to interconnect traces of two conductive layers in a printed circuit boardPROLINX LABS CORP·Filed 1995·Granted May 25, 1999·203 cites·30 claims
- 1293US10263779B2Secure communications using loop-based authentication flowJONETIX CORP·Filed 2016·Granted Apr 16, 2019·12 cites·25 claims
- 1393US7289211B1System and method for imaging sub-surface polarization-sensitive material structuresWALSH JR JOSEPH T·Filed 2005·Granted Oct 30, 2007·98 cites·20 claims
- 1492US7345507B1Multi-product die configurable as two or more programmable integrated circuits of different logic capacitiesXILINX INC·Filed 2006·Granted Mar 18, 2008·27 cites·20 claims
- 1592US5872338AMultilayer board having insulating isolation ringsPROLINX LABS CORP·Filed 1996·Granted Feb 16, 1999·125 cites·20 claims
- 1691US10419416B2Encryption and decryption techniques using shuffle functionJONETIX CORP·Filed 2018·Granted Sep 17, 2019·6 cites·25 claims
- 1790US11516201B2Encryption and decryption techniques using shuffle functionJONETIX CORP·Filed 2021·Granted Nov 29, 2022·2 cites·22 claims
- 1890US5962815AAntifuse interconnect between two conducting layers of a printed circuit boardPROLINX LABS CORP·Filed 1995·Granted Oct 5, 1999·70 cites·11 claims
- 1989US12081531B2Secure communications using loop-based authentication flowJONETIX CORP·Filed 2023·Granted Sep 3, 2024·1 cites·28 claims
- 2089US7605460B1Method and apparatus for a power distribution systemXILINX INC·Filed 2008·Granted Oct 20, 2009·18 cites·20 claims
- 2188US10931658B2Encryption and decryption techniques using shuffle functionJONETIX CORP·Filed 2019·Granted Feb 23, 2021·4 cites·23 claims
- 2284US8519542B2Air through-silicon via structureKIM NAMHOON·Filed 2010·Granted Aug 27, 2013·9 cites·13 claims
- 2384US8198724B1Integrated circuit device having a multi-layer substrate and a method of enabling signals to be routed in a multi-layer substrateWU PAUL YING-FUNG·Filed 2008·Granted Jun 12, 2012·24 cites·19 claims
- 2484US5767575ABall grid array structure and method for packaging an integrated circuit chipPROLINX LABS CORP·Filed 1995·Granted Jun 16, 1998·82 cites·38 claims
- 2584US5537108AMethod and structure for programming fusesPROLINX LABS CORP·Filed 1994·Granted Jul 16, 1996·76 cites·24 claims
- 2682US7498192B1Methods of providing a family of related integrated circuits of different sizesXILINX INC·Filed 2006·Granted Mar 3, 2009·11 cites·20 claims
- 2782US7429501B1Lid and method of employing a lid on an integrated circuitXILINX INC·Filed 2005·Granted Sep 30, 2008·10 cites·5 claims
- 2881US8410579B2Power distribution networkGHIA ATUL V·Filed 2010·Granted Apr 2, 2013·8 cites·20 claims
- 2980US11595368B2Secure communications using loop-based authentication flowJONETIX CORP·Filed 2020·Granted Feb 28, 2023·1 cites·20 claims
- 3080US8395903B1Interconnect pattern for semiconductor packagingWU PAUL YING-FUNG·Filed 2006·Granted Mar 12, 2013·9 cites·5 claims
- 3180US7491576B1Yield-enhancing methods of providing a family of scaled integrated circuitsXILINX INC·Filed 2006·Granted Feb 17, 2009·10 cites·20 claims
- 3280US5987744AMethod for supporting one or more electronic componentsPROLINX LABS CORP·Filed 1997·Granted Nov 23, 1999·54 cites·8 claims
- 3377US9377802B1Dynamic configuration of equivalent series resistanceWYLAND CHRISTOPHER P·Filed 2012·Granted Jun 28, 2016·5 cites·19 claims
- 3477US7012326B1Lid and method of employing a lid on an integrated circuitXILINX INC·Filed 2004·Granted Mar 14, 2006·22 cites·16 claims
- 3575US12069038B2Encryption and decryption techniques using shuffle functionJONETIX CORP·Filed 2022·Granted Aug 20, 2024·0 cites·20 claims
- 3675US9144150B2Conductor structure with integrated via elementWU PAUL Y·Filed 2012·Granted Sep 22, 2015·4 cites·20 claims
- 3773US10742622B2Secure communications using loop-based authentication flowJONETIX CORP·Filed 2019·Granted Aug 11, 2020·1 cites·22 claims
- 3870US12032676B2Secure hardware signature and related methods and applicationsJONETIX CORP·Filed 2022·Granted Jul 9, 2024·0 cites·22 claims
- 3965US11544371B2Secure hardware signature and related methods and applicationsJONETIX CORP·Filed 2020·Granted Jan 3, 2023·0 cites·27 claims
- 4064US8743559B1Interconnect pattern for semiconductor packagingXILINX INC·Filed 2013·Granted Jun 3, 2014·1 cites·20 claims
- 4162US6954198B2Ergonomically shaped computer pointing deviceSHIH HUNG-YING·Filed 2003·Granted Oct 11, 2005·14 cites·7 claims
- 4261US8178962B1Semiconductor device package and methods of manufacturing the sameCHEE SOON-SHIN·Filed 2011·Granted May 15, 2012·2 cites·11 claims
- 4352US12255880B2Cryptographic device, system and method thereofWU PAUL YING FUNG·Filed 2021·Granted Mar 18, 2025·0 cites·3 claims
- 4452US5726482ADevice-under-test card for a burn-in boardPROLINX LABS CORP·Filed 1994·Granted Mar 10, 1998·20 cites·2 claims
- 4547US5906043AProgrammable/reprogrammable structure using fuses and antifusesPROLINX LABS CORP·Filed 1997·Granted May 25, 1999·10 cites·17 claims
- 4645US10038259B2Low insertion loss package pin structure and methodXILINX INC·Filed 2014·Granted Jul 31, 2018·0 cites·14 claims
- 4745US7020858B1Method and apparatus for producing a packaged integrated circuitXILINX INC·Filed 2002·Granted Mar 28, 2006·1 cites·33 claims
- 4845US2015187715A1Semiconductor device having bucket-shaped under-bump metallizaton and method of forming sameXILINX INC·Filed 2015·Application pending·0 cites
- 4945US2011210443A1Semiconductor device having bucket-shaped under-bump metallization and method of forming sameXILINX INC·Filed 2010·Application pending·0 cites
- 5043US2013181360A1Integrated circuit connectivity using flexible circuitryKIM NAMHOON·Filed 2012·Application pending·0 cites
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →