Inventor · disambiguated record
Won Joon Kang
Also filed as: KANG WON JOON
4 granted patents·1 pending application·69 citations·filing 2009–2024
71Inventor score
Top patents by PatentIndex Score
5 records- 0195US8026589B1Reduced profile stackable semiconductor packageAMKOR TECHNOLOGY INC·Filed 2009·Granted Sep 27, 2011·67 cites·25 claims
- 0282US2025029899A1Electronic package structureAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 0377US9929075B2Chip-scale electronic package structure with conductive connective element having increased surface area and laterally spaced connection points for improved connectivityAMKOR TECHNOLOGY INC·Filed 2015·Granted Mar 27, 2018·2 cites·20 claims
- 0471US12131982B2Electronic package structure with reduced vertical stress regionsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Oct 29, 2024·0 cites·20 claims
- 0556US11011455B2Electronic package structure with improved board level reliabilityAMKOR TECHNOLOGY INC·Filed 2018·Granted May 18, 2021·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →