Inventor · disambiguated record
Boon-Tiong Neo
Also filed as: NEO BOON-TIONG
6 granted patents·3 pending applications·24 citations·filing 2005–2015
77Inventor score
Top patents by PatentIndex Score
9 records- 0189US9117695B1Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2014·Granted Aug 25, 2015·11 cites·8 claims
- 0282US8901003B1Polishing method of semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2013·Granted Dec 2, 2014·6 cites·16 claims
- 0365US7432205B2Method for controlling polishing processUNITED MICROELECTRONICS CORP·Filed 2005·Granted Oct 7, 2008·3 cites·16 claims
- 0463US8129278B2Chemical mechanical polishing processNEO BOON-TIONG·Filed 2005·Granted Mar 6, 2012·4 cites·46 claims
- 0543US8759218B2Chemical mechanical polishing processNEO BOON-TIONG·Filed 2011·Granted Jun 24, 2014·0 cites·16 claims
- 0641US2016020246A1Method for fabricating cmos image sensors and surface treating process thereofUNITED MICROELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 0740US9754788B2Manufacturing method of semiconductor structure including planarizing a polysilicon layer over an array area and a periphery areaUNITED MICROELECTRONICS CORP·Filed 2015·Granted Sep 5, 2017·0 cites·14 claims
- 0840US2008242198A1Multi-step planarizing and polishing methodUNITED MICROELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 0935US2007240734A1Method of cleaning post-cmp waferTENG CHING-WEN·Filed 2006·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Boon-Tiong Neo files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →