Inventor · disambiguated record
Janice Danvir
Also filed as: DANVIR JANICE · DANVIR JANICE M
9 granted patents·6 pending applications·538 citations·filing 2001–2007
91Inventor score
Top patents by PatentIndex Score
15 records- 0194US6821878B2Area-array device assembly with pre-applied underfill layers on printed wiring boardFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Nov 23, 2004·119 cites·16 claims
- 0294US6774497B1Flip-chip assembly with thin underfill and thick solder maskFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Aug 10, 2004·209 cites·27 claims
- 0394US6649445B1Wafer coating and singulation methodMOTOROLA INC·Filed 2002·Granted Nov 18, 2003·118 cites·27 claims
- 0486US7199724B2Method and apparatus to aide in emergency egressMOTOROLA INC·Filed 2005·Granted Apr 3, 2007·31 cites·11 claims
- 0582US7924158B2Dynamic updating of product profiles for active lifestylesMOTOROLA MOBILITY INC·Filed 2007·Granted Apr 12, 2011·9 cites·20 claims
- 0681US7834762B2Monitoring for radio frequency enabled items based on activity profilesMOTOROLA INC·Filed 2006·Granted Nov 16, 2010·9 cites·20 claims
- 0775US6650022B1Semiconductor device exhibiting enhanced pattern recognition when illuminated in a machine vision systemMOTOROLA INC·Filed 2002·Granted Nov 18, 2003·29 cites·23 claims
- 0859US7265994B2Underfill film for printed wiring assembliesFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Sep 4, 2007·10 cites·14 claims
- 0958US2008162291A1Dynamic updating of product profiles for active lifestylesMOTOROLA INC·Filed 2006·Application pending·0 cites
- 1054US2008162555A1Active lifestyle managementMOTOROLA INC·Filed 2006·Application pending·0 cites
- 1150US6837293B1Heated nozzle assemblyMOK SWEE M·Filed 2003·Granted Jan 4, 2005·4 cites·15 claims
- 1244US2008132798A1Wireless headsets and wireless communication networks for heart rate monitoringMOTOROLA INC·Filed 2006·Application pending·0 cites
- 1338US2006006817A1AC powered self organizing wireless nodeCHASON MARC K·Filed 2005·Application pending·0 cites
- 1436US2003015720A1Structure and method for fabricating a printed circuit board utilizing a semiconductor structure and an embedded waveguideMOTOROLA INC·Filed 2001·Application pending·0 cites
- 1534US2003132513A1Semiconductor package device and methodMOTOROLA INC·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →