Inventor · disambiguated record
Rolf Aschenbrenner
Also filed as: ASCHENBRENNER ROLF
9 granted patents·215 citations·filing 1995–2000
90Inventor score
Files withFRAUNHOFER GES FORSCHUNG4ZAKEL ELKE3FRANUNHOFER GES ZUR FOERDE RUN1SMART PAC GMBH TECHNOLOGY SERV1
Top patents by PatentIndex Score
9 records- 0187US5906312ASolder bump for flip chip assembly and method of its fabricationFRANUNHOFER GES ZUR FOERDE RUN·Filed 1995·Granted May 25, 1999·64 cites·14 claims
- 0275US6651891B1Method for producing contactless chip cards and corresponding contactless chip cardZAKEL ELKE·Filed 1997·Granted Nov 25, 2003·56 cites·22 claims
- 0368US6277660B1Method and apparatus for testing chipsFRAUNHOFER GES FORSCHUNG·Filed 2000·Granted Aug 21, 2001·12 cites·10 claims
- 0462US5989993AMethod for galvanic forming of bonding padsZAKEL ELKE·Filed 1996·Granted Nov 23, 1999·30 cites·14 claims
- 0553US5928458AFlip chip bonding with non conductive adhesiveFRAUNHOFER GES FORSCHUNG·Filed 1995·Granted Jul 27, 1999·21 cites·7 claims
- 0649US6407457B1Contact-bumpless chip contacting method and an electronic circuit produced by said methodSMART PAC GMBH TECHNOLOGY SERV·Filed 2000·Granted Jun 18, 2002·4 cites·9 claims
- 0748US6211571B1Method and apparatus for testing chipsFRAUNHOFER GES FORSCHUNG·Filed 1996·Granted Apr 3, 2001·12 cites·11 claims
- 0842US6107118AChip-contacting method requiring no contact bumps, and electronic circuit produced in this wayZAKEL ELKE·Filed 1996·Granted Aug 22, 2000·11 cites·9 claims
- 0934US6284639B1Method for forming a structured metallization on a semiconductor waferFRAUNHOFER GES FORSCHUNG·Filed 1999·Granted Sep 4, 2001·5 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →