Inventor · disambiguated record
Jens Albrecht Riege
Also filed as: RIEGE JENS A · RIEGE JENS ALBRECHT
9 granted patents·1 pending application·175 citations·filing 2010–2022
90Inventor score
Top patents by PatentIndex Score
10 records- 0198US9041472B2Power amplifier modules including related systems, devices, and methodsSKYWORKS SOLUTIONS INC·Filed 2013·Granted May 26, 2015·70 cites·29 claims
- 0297US12143077B2Power amplifier modules including semiconductor resistor and tantalum nitride terminated through wafer viaSKYWORKS SOLUTIONS INC·Filed 2022·Granted Nov 12, 2024·3 cites·20 claims
- 0395US9755592B2Power amplifier modules including tantalum nitride terminated through wafer via and related systems, devices, and methodsSKYWORKS SOLUTIONS INC·Filed 2016·Granted Sep 5, 2017·12 cites·20 claims
- 0494US8022448B1Apparatus and methods for evaporation including test wafer holderSKYWORKS SOLUTIONS INC·Filed 2010·Granted Sep 20, 2011·32 cites·13 claims
- 0590US8415770B2Apparatus and methods for uniform metal platingRIEGE JENS A·Filed 2012·Granted Apr 9, 2013·14 cites·11 claims
- 0690US8188575B2Apparatus and method for uniform metal platingRIEGE JENS A·Filed 2010·Granted May 29, 2012·14 cites·26 claims
- 0789US8546048B2Forming sloped resist, via, and metal conductor structures using banded reticle structuresRIEGE JENS ALBRECHT·Filed 2011·Granted Oct 1, 2013·12 cites·32 claims
- 0888US8758553B2Fixtures and methods for unbonding wafers by shear forceRIEGE JENS A·Filed 2010·Granted Jun 24, 2014·11 cites·18 claims
- 0984US8481344B2Methods of evaporating metal onto a semiconductor wafer in a test wafer holderLUU LAM T·Filed 2011·Granted Jul 9, 2013·7 cites·25 claims
- 1039US2015233008A1Apparatus and methods related to copper plating of wafersSKYWORKS SOLUTIONS INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →