Inventor · disambiguated record
Guido Wenski
Also filed as: WENSKI GUIDO
13 granted patents·4 pending applications·311 citations·filing 1990–2006
93Inventor score
Files withWACKER SILTRONIC HALBLEITERMAT9SILTRONIC AG4CONSORTIUM ELEKTROCHEM IND2WACKER CHEMIE GMBH1WACKER SILTRONIC GES F DOT OVE1
Top patents by PatentIndex Score
17 records- 0186US6514424B2Process for the double-side polishing of semiconductor wafers and carrier for carrying out the processWACKER SILTRONIC HALBLEITERMAT·Filed 2001·Granted Feb 4, 2003·39 cites·14 claims
- 0285US6899762B2Epitaxially coated semiconductor wafer and process for producing itSILTRONIC AG·Filed 2003·Granted May 31, 2005·42 cites·11 claims
- 0383US6530826B2Process for the surface polishing of silicon wafersWACKER SILTRONIC HALBLEITERMAT·Filed 2001·Granted Mar 11, 2003·35 cites·11 claims
- 0481US6583050B2Semiconductor wafer with improved flatness, and process for producing the semiconductor waferWACKER SILTRONIC GES F DOT OVE·Filed 2002·Granted Jun 24, 2003·31 cites·1 claims
- 0581US6458688B1Semiconductor wafer with improved flatness, and process for producing the semiconductor waferWACKER SILTRONIC HALBLEITERMAT·Filed 2000·Granted Oct 1, 2002·27 cites·15 claims
- 0677US6566267B1Inexpensive process for producing a multiplicity of semiconductor wafersWACKER SILTRONIC HALBLEITERMAT·Filed 2000·Granted May 20, 2003·21 cites·13 claims
- 0776US6861360B2Double-sided polishing process for producing a multiplicity of silicon semiconductor wafersSILTRONIC AG·Filed 2002·Granted Mar 1, 2005·20 cites·21 claims
- 0873US6793837B2Process for material-removing machining of both sides of semiconductor wafersSILTRONIC AG·Filed 2002·Granted Sep 21, 2004·18 cites·14 claims
- 0971US6645862B2Double-side polishing process with reduced scratch rate and device for carrying out the processWACKER SILTRONIC HALBLEITERMAT·Filed 2001·Granted Nov 11, 2003·16 cites·11 claims
- 1069US7541287B2Method for machining a semiconductor wafer on both sides in a carrier, carrier, and a semiconductor wafer produced by the methodSILTRONIC AG·Filed 2006·Granted Jun 2, 2009·3 cites·6 claims
- 1168US5527755ACatalyst for the catalytic afterburning of exhaust gases containing carbon monoxide and/or oxidizable organic compoundsCONSORTIUM ELEKTROCHEM IND·Filed 1993·Granted Jun 18, 1996·38 cites·8 claims
- 1256US5009934AProcess for preparing poly-(imidesiloxanes)WACKER CHEMIE GMBH·Filed 1990·Granted Apr 23, 1991·18 cites·13 claims
- 1338US2003041798A1Coated silicon wafer and process for its productionWACKER SILTRONIC HALBLEITERMAT·Filed 2002·Application pending·0 cites
- 1436US2002055324A1Process for polishing silicon wafersWACKER SILTRONIC HALBLEITERMAT·Filed 2001·Application pending·0 cites
- 1535US2001039101A1Method for converting a reclaim wafer into a semiconductor waferWACKER SILTRONIC HALBLEITERMAT·Filed 2001·Application pending·0 cites
- 1635US2001014570A1Process for producing a semiconductor wafer with polished edgeWACKER SILTRONIC HALBLEITERMAT·Filed 2001·Application pending·0 cites
- 1733US5072069ACycloolefinic complexes of platinum, processes for preparing the same and their use as a catalystCONSORTIUM ELEKTROCHEM IND·Filed 1990·Granted Dec 10, 1991·3 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →