Inventor · disambiguated record
Shiro Yoshino
Also filed as: YOSHINO SHIRO
8 granted patents·2 pending applications·45 citations·filing 1991–2007
84Inventor score
Files withSUMCO TECHXIV CORP4KOMATSU DENSHI KINZOKU KK3KOMATSU DENSHI SINZOKU KABUSHI1NAKAMURA KOZO1SADOHARA SHINYA1
Top patents by PatentIndex Score
10 records- 0184US7759227B2Silicon semiconductor substrate heat-treatment method and silicon semiconductor substrate treated by the methodSUMCO TECHXIV CORP·Filed 2005·Granted Jul 20, 2010·13 cites·6 claims
- 0262US7875116B2Silicon single crystal producing method, annealed wafer, and method of producing annealed waferSUMCO TECHXIV CORP·Filed 2006·Granted Jan 25, 2011·2 cites·8 claims
- 0359US8246744B2Method for predicting precipitation behavior of oxygen in silicon single crystal, method for determining production parameter of silicon single crystal, and storage medium for storing program for predicting precipitation behavior of oxygen in silicon single crystalNAKAMURA KOZO·Filed 2005·Granted Aug 21, 2012·1 cites·6 claims
- 0456US8573969B2Silicon wafer heat treatment methodSADOHARA SHINYA·Filed 2007·Granted Nov 5, 2013·1 cites·7 claims
- 0552US2007113778A1Epitaxial silicon waferSUMCO TECHXIV CORP·Filed 2007·Application pending·0 cites
- 0648US6800132B1Silicon wafer and method for manufacture thereof, and method for evaluation of silicon waferKOMATSU DENSHI SINZOKU KABUSHI·Filed 2000·Granted Oct 5, 2004·3 cites·14 claims
- 0743US7226505B2Method for vanishing defects in single crystal silicon and single crystal siliconSUMCO TECHXIV CORP·Filed 2002·Granted Jun 5, 2007·2 cites·11 claims
- 0841US2004065250A1Epitaxial silicon waferKOMATSU DENSHI KINZOKU KK·Filed 2003·Application pending·0 cites
- 0939US5385115ASemiconductor wafer heat treatment methodKOMATSU DENSHI KINZOKU KK·Filed 1991·Granted Jan 31, 1995·12 cites·7 claims
- 1037US5708365AMethod for analysis of silicon wafersKOMATSU DENSHI KINZOKU KK·Filed 1996·Granted Jan 13, 1998·11 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →