Inventor · disambiguated record
Hideyuki Ichiyama
Also filed as: ICHIYAMA HIDEYUKI
10 granted patents·1,075 citations·filing 1988–1998
93Inventor score
Top patents by PatentIndex Score
10 records- 0196US5900582ALead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frameMITSUBISHI ELECTRIC CORP·Filed 1998·Granted May 4, 1999·106 cites·2 claims
- 0295US5814883APackaged semiconductor chipMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Sep 29, 1998·313 cites·7 claims
- 0395US5592019ASemiconductor device and moduleMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Jan 7, 1997·341 cites·12 claims
- 0493US5535509AMethod of making a lead on chip (LOC) semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Jul 16, 1996·68 cites·6 claims
- 0591US5207102ASemiconductor pressure sensorMITSUBISHI ELECTRIC CORP·Filed 1991·Granted May 4, 1993·127 cites·5 claims
- 0683US5763829ALeadframe including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the leadframeMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Jun 9, 1998·38 cites·2 claims
- 0773US5372295ASolder material, junctioning method, junction material, and semiconductor deviceRYODEN SEMICONDUCTOR SYST ENG·Filed 1992·Granted Dec 13, 1994·47 cites·23 claims
- 0853US5724726AMethod of making leadframe for lead-on-chip (LOC) semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Mar 10, 1998·11 cites·4 claims
- 0950US5373190AResin-sealed semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Dec 13, 1994·19 cites·1 claims
- 1033US4974052APlastic packaged semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Nov 27, 1990·5 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →