Inventor · disambiguated record
Kou Shimomura
Also filed as: SHIMOMURA KOU
4 granted patents·373 citations·filing 1987–1995
78Inventor score
Files withMITSUBISHI ELECTRIC CORP4
Top patents by PatentIndex Score
4 records- 0195US5592019ASemiconductor device and moduleMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Jan 7, 1997·341 cites·12 claims
- 0261US5196917ACarrier tapeMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Mar 23, 1993·26 cites·3 claims
- 0334US5034436ASemiconductor sealing epoxy resin compositionMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Jul 23, 1991·4 cites·6 claims
- 0426US4824801AMethod of manufacturing aluminum bonding pad with PSG coatingMITSUBISHI ELECTRIC CORP·Filed 1987·Granted Apr 25, 1989·2 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →