Inventor · disambiguated record
Wei-Chi Liu
Also filed as: LIU WEI · LIU WEI-CHI
15 granted patents·8 pending applications·54 citations·filing 1997–2025
89Inventor score
Files withCORETRONIC CORP13VALENCE TECHNOLOGY INC2GIP TECH CORPORATION1SILICON INTEGRATED SYS CORP1UNIV LELAND STANFORD JUNIOR1
Top patents by PatentIndex Score
23 records- 0192US10969667B2Wavelength conversion module and projection deviceCORETRONIC CORP·Filed 2020·Granted Apr 6, 2021·3 cites·22 claims
- 0289US10827647B2Liquid-cooling deviceCORETRONIC CORP·Filed 2019·Granted Nov 3, 2020·6 cites·18 claims
- 0381US10281807B2Projector, heat dissipation module, and heat dissipation fin setCORETRONIC CORP·Filed 2018·Granted May 7, 2019·3 cites·20 claims
- 0478US6319627B1Use of polymer mesh for improvement of safety, performance and assembly of batteriesVALENCE TECHNOLOGY INC·Filed 2000·Granted Nov 20, 2001·16 cites·6 claims
- 0575US10976116B2Liquid cooled heat dissipation deviceCORETRONIC CORP·Filed 2019·Granted Apr 13, 2021·1 cites·9 claims
- 0663US12339572B2Heat dissipating module and projection deviceCORETRONIC CORP·Filed 2022·Granted Jun 24, 2025·0 cites·11 claims
- 0760US11500274B2ProjectorCORETRONIC CORP·Filed 2021·Granted Nov 15, 2022·0 cites·20 claims
- 0859US2024055825A1Control system for a laser source and method for controlling an output power of the laser sourceGIP TECH CORPORATION·Filed 2022·Application pending·0 cites
- 0958US11194238B2Heat dissipation module and projection apparatusCORETRONIC CORP·Filed 2020·Granted Dec 7, 2021·0 cites·19 claims
- 1057US6882037B2Die paddle for receiving an integrated circuit die in a plastic substrateSILICON INTEGRATED SYS CORP·Filed 2002·Granted Apr 19, 2005·7 cites·18 claims
- 1156US12372861B2Projection deviceCORETRONIC CORP·Filed 2022·Granted Jul 29, 2025·0 cites·12 claims
- 1251US11714341B2Projection device with tank for dissipating heatCORETRONIC CORP·Filed 2021·Granted Aug 1, 2023·0 cites·17 claims
- 1351US2023057909A1Projection deviceCORETRONIC CORP·Filed 2022·Application pending·0 cites
- 1451US2025290976A1Chip package structure, fabrication method and memory systemYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 1550US6168880B1Use of polymer mesh for improvement of safety, performance and assembly of batteriesVALENCE TECHNOLOGY INC·Filed 1997·Granted Jan 2, 2001·18 cites·12 claims
- 1649US11506961B2Heat dissipation module and projection apparatus using the sameCORETRONIC CORP·Filed 2020·Granted Nov 22, 2022·0 cites·15 claims
- 1747US11009783B2Liquid cooled heat dissipation module and projection deviceCORETRONIC CORP·Filed 2019·Granted May 18, 2021·0 cites·20 claims
- 1846US11255534B2Thermal module and projectorCORETRONIC CORP·Filed 2018·Granted Feb 22, 2022·0 cites·19 claims
- 1943US2010018676A1Planar Heat Dissipating DeviceUNIV NAT CENTRAL·Filed 2009·Application pending·0 cites
- 2037US2005093136A1Thermal dissipating element of a chipFiled 2003·Application pending·0 cites
- 2137US2005093135A1Thermal dissipating element of a chipFiled 2003·Application pending·0 cites
- 2236US2018269648A1Generation of arbitrary time-space distribution phase-coherent discretized laser beamsUNIV LELAND STANFORD JUNIOR·Filed 2018·Application pending·0 cites
- 2335US2006264073A1Planar heat dissipating deviceYANG CHIEN-YUH·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →