Inventor · disambiguated record
Yoshihito Inaba
Also filed as: INABA YOSHIHITO
11 granted patents·2 pending applications·595 citations·filing 1973–2023
92Inventor score
Top patents by PatentIndex Score
13 records- 0197US3960757AProcess for encapsulation of medicamentsTOYO JOZO KK·Filed 1973·Granted Jun 1, 1976·285 cites·16 claims
- 0292US3943063APreparation of microcapsulesTOYO JOZO KK·Filed 1973·Granted Mar 9, 1976·143 cites·18 claims
- 0390US12084599B2Semiconductor device manufacturing method, curable resin composition for temporary fixation material, film for temporary fixation material, and laminated film for temporary fixation materialRESONAC CORP·Filed 2023·Granted Sep 10, 2024·2 cites·7 claims
- 0489US3953360APreparation of selective adsorbing particlesTOYO JOZO KK·Filed 1974·Granted Apr 27, 1976·42 cites·7 claims
- 0585US3951859AMolecular sieving particle and preparation thereofTOYO JOZO KK·Filed 1973·Granted Apr 20, 1976·35 cites·14 claims
- 0682US4118336ANovel cellulose microcapsules and preparation thereofTOYO JOZO KK·Filed 1976·Granted Oct 3, 1978·35 cites·20 claims
- 0779US4135943ANovel selective adsorbentsTOYO JOZO KK·Filed 1976·Granted Jan 23, 1979·27 cites·30 claims
- 0875US11840648B2Semiconductor device manufacturing method, curable resin composition for temporary fixation material, film for temporary fixation material, and laminated film for temporary fixation materialHITACHI CHEMICAL CO LTD·Filed 2018·Granted Dec 12, 2023·2 cites·11 claims
- 0971US4123381AProcess for producing cellulose microcapsules, and resulting cellulose microcapsulesTOYO JOZO KK·Filed 1977·Granted Oct 31, 1978·24 cites·10 claims
- 1064US11873414B2Sealing resin composition, electronic component device, and method of manufacturing electronic component deviceSHOWA DENKO MATERIALS CO LTD·Filed 2021·Granted Jan 16, 2024·0 cites·15 claims
- 1156US2025353078A1Compound, molded body and cured productRESONAC CORP·Filed 2023·Application pending·0 cites
- 1250US11186742B2Sealing resin composition, electronic component device, and method of manufacturing electronic component deviceHITACHI CHEMICAL CO LTD·Filed 2017·Granted Nov 30, 2021·0 cites·16 claims
- 1339US2022028722A1Semiconductor device production method and laminate film for temporary fixation materialSHOWA DENKO MATERIALS CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →