Inventor · disambiguated record
Tong-Suk Kim
Also filed as: KIM TONG S · KIM TONG-SUK
8 granted patents·3 pending applications·122 citations·filing 1979–2024
84Inventor score
Top patents by PatentIndex Score
11 records- 0192US4370868ADistributor for plate fin evaporatorBORG WARNER·Filed 1981·Granted Feb 1, 1983·92 cites·14 claims
- 0283US2024321842A1Package-on-package (pop) semiconductor package and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0380US8400779B2Semiconductor package having multi pitch ball landKIM TONG-SUK·Filed 2010·Granted Mar 19, 2013·6 cites·27 claims
- 0479US12033991B2Package-on-package (PoP) semiconductor package and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 9, 2024·0 cites·20 claims
- 0573US8817486B2Semiconductor package having multi pitch ball landKIM TONG-SUK·Filed 2013·Granted Aug 26, 2014·3 cites·11 claims
- 0672US4279578ACompact oil separator for rotary compressorBORG WARNER·Filed 1979·Granted Jul 21, 1981·21 cites·6 claims
- 0770US10971484B2Package-on-package (PoP) semiconductor package and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 6, 2021·0 cites·20 claims
- 0868US11552062B2Package-on-package (PoP) semiconductor package and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 10, 2023·0 cites·19 claims
- 0959US10692846B2Package-on-package (PoP) semiconductor package and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 23, 2020·0 cites·19 claims
- 1054US2024234274A1Semiconductor package including an edge region having a plurality of solder balls thereinSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1133US2012068350A1Semiconductor packages, electronic devices and electronic systems employing the sameKIM TONG-SUK·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →