Inventor · disambiguated record
Kukjin Chun
Also filed as: CHUN KUKJIN
3 granted patents·3 pending applications·41 citations·filing 2003–2015
70Inventor score
Top patents by PatentIndex Score
6 records- 0179US6884650B2Side-bonding method of flip-chip semiconductor device, MEMS device package and package method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Apr 26, 2005·31 cites·20 claims
- 0276US9759675B2Particulate matter sensor unitHYUNDAI MOTOR CO LTD·Filed 2014·Granted Sep 12, 2017·3 cites·6 claims
- 0374US7285967B2Probe card having deeply recessed trench and method for manufacturing the sameUNITEST INC·Filed 2005·Granted Oct 23, 2007·7 cites·11 claims
- 0452US2015316448A1Particulate matter sensor unitHYUNDAI MOTOR CO LTD·Filed 2015·Application pending·0 cites
- 0550US2013145821A1Particulate matter sensor unitLEE JIN HA·Filed 2012·Application pending·0 cites
- 0650US2014116113A1Particulate matter sensor unitHYUNDAI MOTOR CO LTD·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →