Inventor · disambiguated record
Hyun-Tae Jang
Also filed as: JANG HYUN TAE
12 granted patents·23 citations·filing 2009–2019
86Inventor score
Top patents by PatentIndex Score
12 records- 0186US9582051B2Mobile communication terminal having radiant-heat sheetSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Feb 28, 2017·6 cites·8 claims
- 0285US9832859B2Printed circuit board assembly and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Nov 28, 2017·5 cites·26 claims
- 0375US11805633B2Electrical element transfer apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 31, 2023·2 cites·5 claims
- 0474US11387220B2Display comprising light-emitting chips and manufacturing method thereforSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jul 12, 2022·2 cites·15 claims
- 0574US10010016B2Shield can device for shielding electromagnetic waveSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 26, 2018·2 cites·15 claims
- 0672US10698461B2Electronic device and heat control method based on temperature of battery in electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 30, 2020·2 cites·19 claims
- 0764US8530613B2Preparation of meso-porous polymer based nano-polymerized composite materialJANG HYUN TAE·Filed 2009·Granted Sep 10, 2013·4 cites·7 claims
- 0858USRE48641EMobile communication terminal having radiant-heat sheetSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 13, 2021·0 cites·18 claims
- 0955US10542646B2Surface mount metal unit and electric device including sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 21, 2020·0 cites·20 claims
- 1040US11032952B2Electronic device including shield canSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 8, 2021·0 cites·20 claims
- 1139US10573951B2Split resonator and printed circuit board including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 25, 2020·0 cites·19 claims
- 1235US10117367B2Fastening structure for shield canSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Oct 30, 2018·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →