Inventor · disambiguated record
David Bang
Also filed as: BANG DAVID · BANG DAVID S
17 granted patents·1 pending application·454 citations·filing 1994–2015
95Inventor score
Top patents by PatentIndex Score
18 records- 0190US5949143ASemiconductor interconnect structure with air gap for reducing intralayer capacitance in metal layers in damascene metalization processADVANCED MICRO DEVICES INC·Filed 1998·Granted Sep 7, 1999·101 cites·4 claims
- 0290US5643428AMultiple tier collimator system for enhanced step coverage and uniformityADVANCED MICRO DEVICES INC·Filed 1995·Granted Jul 1, 1997·67 cites·10 claims
- 0382US6268277B1Method of producing air gap for reducing intralayer capacitance in metal layers in damascene metalization process and product resulting therefromADVANCED MICRO DEVICES INC·Filed 1999·Granted Jul 31, 2001·59 cites·2 claims
- 0479US8933567B2Electrically broken, but mechanically continuous die seal for integrated circuitsBANG DAVID·Filed 2010·Granted Jan 13, 2015·6 cites·21 claims
- 0577US6047243AMethod for quantifying ultra-thin dielectric reliability: time dependent dielectric wear-outADVANCED MICRO DEVICES INC·Filed 1997·Granted Apr 4, 2000·38 cites·23 claims
- 0676US6127193ATest structure used to measure metal bottom coverage in trenches and vias/contacts and method for creating the test structureADVANCED MICRO DEVICES INC·Filed 1998·Granted Oct 3, 2000·41 cites·20 claims
- 0775US9159910B2One-mask MTJ integration for STT MRAMKANG SEUNG H·Filed 2009·Granted Oct 13, 2015·8 cites·13 claims
- 0873US6169039B1Electron bean curing of low-k dielectrics in integrated circuitsADVANCED MICRO DEVICES INC·Filed 1998·Granted Jan 2, 2001·41 cites·21 claims
- 0971US8483997B2Predictive modeling of contact and via modules for advanced on-chip interconnect technologyLI XIA·Filed 2009·Granted Jul 9, 2013·5 cites·15 claims
- 1070US7675372B2Circuit simulator parameter extraction using a configurable ring oscillatorQUALCOMM INC·Filed 2007·Granted Mar 9, 2010·5 cites·17 claims
- 1169US8207569B2Intertwined finger capacitorsBANG DAVID·Filed 2007·Granted Jun 26, 2012·5 cites·19 claims
- 1264US5953625AAir voids underneath metal lines to reduce parasitic capacitanceADVANCED MICRO DEVICES INC·Filed 1997·Granted Sep 14, 1999·30 cites·15 claims
- 1361US5580428APVD sputter system having nonplanar target configuration and methods for constructing sameADVANCED MICRO DEVICES INC·Filed 1995·Granted Dec 3, 1996·20 cites·7 claims
- 1460US5556525APVD sputter system having nonplanar target configuration and methods for operating sameADVANCED MICRO DEVICES INC·Filed 1994·Granted Sep 17, 1996·17 cites·28 claims
- 1555US7973541B2Method and apparatus for estimating resistance and capacitance of metal interconnectsQUALCOMM INC·Filed 2007·Granted Jul 5, 2011·2 cites·19 claims
- 1653US6380556B1Test structure used to measure metal bottom coverage in trenches and vias/contacts and method for creating the test structureADVANCED MICRO DEVICES INC·Filed 2000·Granted Apr 30, 2002·3 cites·8 claims
- 1741US2016020383A1One-mask mtj integration for stt mramQUALCOMM INC·Filed 2015·Application pending·0 cites
- 1840US6274915B1Method of improving MOS device performance by controlling degree of depletion in the gate electrodeADVANCED MICRO DEVICES INC·Filed 1999·Granted Aug 14, 2001·6 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →