Inventor · disambiguated record
Feng-Inn Wu
Also filed as: WU FENG · WU FENG-INN
21 granted patents·8 pending applications·33 citations·filing 2002–2025
91Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD12CHANGXIN MEMORY TECH INC3WANG SHENG-CHEN2ZHOU MINGJIE2BEIJING INSTITUTE TECH1
Top patents by PatentIndex Score
29 records- 0194US9481069B2Chemical mechanical polishing apparatus and polishing method using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Nov 1, 2016·17 cites·20 claims
- 0291US11984324B2Method of manufacturing a semiconductor device and a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 14, 2024·2 cites·20 claims
- 0383US12116891B1Calculation method for mobile fluid saturation after reservoir fracturing based on netting analysisUNIV SOUTHWEST PETROLEUM·Filed 2024·Granted Oct 15, 2024·3 cites·8 claims
- 0481US2025364267A1Method of manufacturing a semiconductor device and a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0580US12128522B2Polishing head, chemical-mechanical polishing system and method for polishing substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 29, 2024·0 cites·20 claims
- 0676US12451363B2Method of manufacturing a semiconductor device and a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 21, 2025·0 cites·20 claims
- 0771US9255107B2Heteroaryl alkyne compound and use thereofNANJING SANHOME PHARMACEUTICAL CO LTD·Filed 2013·Granted Feb 9, 2016·1 cites·18 claims
- 0869US11407083B2Polishing head, chemical-mechanical polishing system and method for polishing substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 9, 2022·0 cites·20 claims
- 0969US2024387398A1Cmp safe alignment markTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1067US2025263513A1Pvp comb copolymer and preparation method therefor and use thereofSHANGHAI YUKING WATER SOLUBLE MAT TECH CO LTD·Filed 2023·Application pending·0 cites
- 1166US9908213B2Method of CMP pad conditioningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 6, 2018·1 cites·20 claims
- 1265US8939815B2Systems providing an air zone for a chucking stageTSAI HUI-TING·Filed 2011·Granted Jan 27, 2015·3 cites·19 claims
- 1362US11631886B2Quasi-solid-state electrolyte based on ionic liquid for use in lithium battery and preparation method thereofBEIJING INSTITUTE TECH·Filed 2019·Granted Apr 18, 2023·0 cites·5 claims
- 1458US12060385B2Compounds for RNA capping and uses thereofGUANGZHOU HENOVCOM BIOSCIENCE CO LTD·Filed 2023·Granted Aug 13, 2024·0 cites·29 claims
- 1558US2023373062A1Chemical mechanical polishing apparatus with integrated slurry mixer-dispenser and methods for operating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1657US9768080B2Semiconductor manufacturing apparatus and method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 19, 2017·1 cites·14 claims
- 1757US9149906B2Apparatus for CMP pad conditioningYEH HSIU-MING·Filed 2011·Granted Oct 6, 2015·1 cites·18 claims
- 1857US2023189505A1Semiconductor structure and method for preparing semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 1956US12255150B2CMP safe alignment markTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 18, 2025·0 cites·13 claims
- 2056US10328549B2Polishing head, chemical-mechanical polishing system and method for polishing substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jun 25, 2019·0 cites·20 claims
- 2153US12193212B2Method of forming semiconductor device and semiconductor deviceCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jan 7, 2025·0 cites·13 claims
- 2252US8992287B2Slurry supply system for CMP processWANG SHENG-CHEN·Filed 2011·Granted Mar 31, 2015·1 cites·20 claims
- 2349US11622488B2Semiconductor structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2021·Granted Apr 4, 2023·0 cites·13 claims
- 2446US2015125758A1Graphene film, preparation method and application thereofZHOU MINGJIE·Filed 2012·Application pending·0 cites
- 2545US6664189B1Removal of wafer edge defocus due to CMPTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Dec 16, 2003·3 cites·34 claims
- 2640US2013252499A1Graphene derivative-carbon nanotube composite material and preparation methods thereofZHOU MINGJIE·Filed 2010·Application pending·0 cites
- 2738US9382480B2Dichromatic dye composition and application thereofJIANGSU HECHENG DISPLAY TECH·Filed 2013·Granted Jul 5, 2016·0 cites·14 claims
- 2838US2020408764A1COLORECTAL CANCER DIAGNOSIS COMPRISING DETECTION OF lgG4UNIV SUN YAT SEN·Filed 2018·Application pending·0 cites
- 2937US9418904B2Localized CMP to improve wafer planarizationWANG SHENG-CHEN·Filed 2011·Granted Aug 16, 2016·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →