Inventor · disambiguated record
Aya Momozawa
Also filed as: MOMOZAWA AYA
4 granted patents·5 pending applications·2 citations·filing 2015–2021
56Inventor score
Files withTOKYO OHKA KOGYO CO LTD9
Top patents by PatentIndex Score
9 records- 0169US9448478B2Chemically amplified positive-type photosensitive resin composition for thick-film applicationTOKYO OHKA KOGYO CO LTD·Filed 2015·Granted Sep 20, 2016·2 cites·6 claims
- 0251US2024053680A1Photosensitive dry film, laminated film, method for producing laminated film, and method for producing patterned resist filmTOKYO OHKA KOGYO CO LTD·Filed 2021·Application pending·0 cites
- 0345US2020292939A1Photosensitive resin composition, photosensitive dry film, method of manufacturing photosensitive dry film, method of manufacturing patterned resist film, method of manufacturing substrate with template and method of manufacturing plated articleTOKYO OHKA KOGYO CO LTD·Filed 2020·Application pending·0 cites
- 0442US2020142307A1Chemically amplified positive-type photosensitive resin composition, photosensitive dry film, method of manufacturing photosensitive dry film, method of manufacturing patterned resist film, method of manufacturing substrate with template and method of manufacturing plated articleTOKYO OHKA KOGYO CO LTD·Filed 2019·Application pending·0 cites
- 0538US2021055655A1Method for manufacturing plated molded articleTOKYO OHKA KOGYO CO LTD·Filed 2019·Application pending·0 cites
- 0638US2018259850A1Method for forming patterned cured film, photosensitive composition, dry film, and method for producing plated shaped articleTOKYO OHKA KOGYO CO LTD·Filed 2018·Application pending·0 cites
- 0735US10261415B2Chemically amplified positive-type photosensitive resin compositionTOKYO OHKA KOGYO CO LTD·Filed 2017·Granted Apr 16, 2019·0 cites·13 claims
- 0829US10353291B2Method for forming photosensitive resin layer, method for producing photoresist pattern, and method for producing plated molded articleTOKYO OHKA KOGYO CO LTD·Filed 2016·Granted Jul 16, 2019·0 cites·19 claims
- 0926US10054855B2Chemically amplified positive-type photosensitive resin compositionTOKYO OHKA KOGYO CO LTD·Filed 2016·Granted Aug 21, 2018·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →